14
CPWR-AN17, Rev -, 05-2016
Copyright © 2016 Cree, Inc. All rights reserved.
The information in this document is subject to change without notice.
Cree, the Cree logo, and Zero Recovery are registered trademarks of Cree, Inc.
4.1
Test Pad Locations
Figure 8. Board Top View with test points labeled
The test pads highlighted in Figure 8 allow various types of pin headers and solderable
posts to be soldered on all the major nodes so oscilloscope probes can be attached.
Figure 9 shows a pair of pin headers soldered onto test points 6&7 allowing an
oscilloscope probe to monitor V
DS
for the lower MOSFET (Figure 10).
Figure 9. Pin headers on test points
Figure 10. Scope probe on pin headers
Terminals CON1, CON2, CON3 and CON4 are the power terminals, and their definitions
vary based on topology. The terminals are vertical through-hole connectors with a 10-
32 threaded hole and a screw provided. The terminals can accommodate a cable with a
