V-1
CHAPTER V TROUBLESHOOTING
1. PREFACE
1.1
Troubleshooting Procedure
The troubleshooting procedure can roughly be divided into two:
Level 1 troubleshooting
The level 1 FIP isolates the presence of various troubles including fail codes.
Level 2 Troubleshooting
Level 2 troubleshooting is a procedure in which troubles are classified by FIP, BSD or fail
codes list.
1.2
Notes on Troubleshooting
•
When replacing parts, check in advance that the connectors are connected securely.
•
When replacing parts, turn the power off.
•
If there are several troubles, you may refer to the same FIP again. Note that the
judgment may differ in the middle even when the FIP is identical.
WARNING
When the power is on, do not touch the parts listed below. You may receive an electrical
shock.
•
HVPS
•
LVPS
WARNING
When the power is on, do not remove drum cartridge. An invisible laser beam may
damage your eye.
WARNING
Heat roll and pressure roll, and their peripheries become very hot. Do not touch when
they are still hot. You may get burnt.
Summary of Contents for HL-4000CN
Page 22: ...CHAPTER I SPECIFICATIONS ...
Page 52: ...CHAPTER II INSTALLATION ...
Page 76: ...CHAPTER III STRUCTURE OF SYSTEM COMPONENTS ...
Page 129: ...CHAPTER IV ASSEMBLY DISASSEMBLY ...
Page 132: ...2 5 21 Roll ASSY IV 74 2 5 22 Cassette ASSY front IV 74 2 5 23 Holder retard IV 75 ...
Page 208: ...CHAPTER V TROUBLESHOOTING ...
Page 281: ...V 71 9 4 Straightness Fig 5 13 9 5 Magnification Error Fig 5 14 9 6 Registration Fig 5 15 ...
Page 282: ...V 72 9 7 Guaranteed Printing Area Fig 5 16 ...
Page 295: ...CHAPTER VI 5 06 ...
Page 336: ...CHAPTER VII 3 8 3 211 725 2 7 216 ...
Page 341: ...VII 4 P J LAYOUT DIAGRAM 2 1 IOT Top ...
Page 342: ...VII 5 2 2 IOT Front RH ...
Page 343: ...VII 6 2 3 MCU and HVPS PWB ESS PWB ...
Page 344: ...VII 7 2 4 Tray1 ...
Page 345: ...VII 8 2 5 2 Tray Module ...