Contents
page 4
Beckhoff New Automation Technology
CB3053
5.4.2
Hard Disk Boot Priority ....................................................................................................... 45
5.5
Advanced Chipset Features ....................................................................................................... 46
5.6
Integrated Peripherals ................................................................................................................ 47
5.6.1
OnChip IDE Devices ........................................................................................................... 48
5.6.2
Onboard Devices ................................................................................................................ 49
5.6.3
SuperIO Devices ................................................................................................................. 50
5.6.4
USB Device Setting ............................................................................................................ 51
5.7
Power Management Setup ......................................................................................................... 52
5.7.1
HPET Feature ..................................................................................................................... 53
5.7.2
Intel DTS Feature ............................................................................................................... 54
5.8
PnP/PCI Configuration ................................................................................................................ 55
5.8.1
IRQ Resources ................................................................................................................... 56
5.9
PC Health Status ........................................................................................................................ 57
5.10
Load Fail-Safe Defaults .............................................................................................................. 59
5.11
Load Optimized Defaults ............................................................................................................ 59
5.12
Set Password .............................................................................................................................. 59
5.13
Save & Exit Setup ....................................................................................................................... 59
5.14
Exit Without Saving ..................................................................................................................... 59
6
BIOS update ....................................................................................................................................... 60
7
Mechanical Drawings ......................................................................................................................... 61
7.1
PCB: Mounting Holes ................................................................................................................. 61
7.2
PCB: Pin 1 Dimensions .............................................................................................................. 62
7.3
PCB: Die Center ......................................................................................................................... 63
8
Technical Data ................................................................................................................................... 64
8.1
Electrical Data ............................................................................................................................. 64
8.2
Environmental Conditions ........................................................................................................... 64
8.3
Thermal Specifications ............................................................................................................... 65
9
Support and Service .......................................................................................................................... 66
9.1
Beckhoff's Branch Offices and Representatives ........................................................................ 66
9.2
Beckhoff Headquarters ............................................................................................................... 66
9.2.1
Beckhoff Support ................................................................................................................ 66
9.2.2
Beckhoff Service ................................................................................................................. 66
I
Annex: Post-Codes ............................................................................................................................ 68
II
Annex: Resources .............................................................................................................................. 71
IO Range ................................................................................................................................................ 71
Memory Range ....................................................................................................................................... 71
Interrupt .................................................................................................................................................. 71
PCI Devices ............................................................................................................................................ 72
SMB Devices .......................................................................................................................................... 72
