Chapter:
Overview
Specifications and Documents
page 14
Beckhoff New Automation Technology
CB3053
2.2 Specifications and Documents
In making this manual and for further reading of technical documentation, the following documents,
specifications and web-pages were used and are recommended.
PCI Specification
Version 2.3 resp. 3.0
www.pcisig.com
ACPI Specification
Version 3.0
www.acpi.info
ATA/ATAPI Specification
Version 7 Rev. 1
www.t13.org
USB Specifications
www.usb.org
SM-Bus Specification
Version 2.0
www.smbus.org
Intel® Chipset Documentation
SCH Datasheet
www.intel.com
Intel® Chip Documentation
Atom Datasheet
www.intel.com
Winbond® Chip Documentation
W83627HG
www.winbond-usa.com oder www.winbond.com.tw
Intel® Chip Documentation
82575EB Datasheet
www.intel.com