English
6
1.2 Specifications
Platform
•
Micro ATX Form Factor
•
Solid Capacitor design
•
2oz Copper PCB
CPU
•
Supports 12
th
Gen Intel® Core
TM
Processors (LGA1700)
•
Digi Power design
•
9 Power Phase design
•
Supports Intel® Hybrid Technology
•
Supports Intel® Turbo Boost Max 3.0 Technology
Chipset
•
Intel® B660
Memory
•
Dual Channel DDR5 Memory Technology
•
4 x DDR5 DIMM Slots
•
Supports DDR5 non-ECC, un-buffered memory up to
6400+(OC)*
1DPC 1R Up to 6400+ MHz (OC), 4800 MHz Natively.
1DPC 2R Up to 6000+ MHz (OC), 4400 MHz Natively.
2DPC 1R Up to 4800+ MHz (OC), 4000 MHz Natively.
2DPC 2R Up to 4800+ MHz (OC), 3600 MHz Natively.
* Please refer to Memory Support List on ASRock's website for
more information. (http://www.asrock.com/)
•
Max. capacity of system memory: 128GB
•
Supports Intel® Extreme Memory Profile (XMP) 3.0
•
15μ Gold Contact in DIMM Slots
Expansion
Slot
CPU:
•
1 x PCIe 5.0 x16 Slot (PCIE1), supports x16 mode*
Chipset:
•
1 x PCIe 3.0 x1 Slot (PCIE2)*
•
1 x M.2 Socket (Key E), supports type 2230 WiFi/BT PCIe
WiFi module and Intel® CNVi (Integrated WiFi/BT)
* Supports NVMe SSD as boot disks
•
15μ Gold Contact in VGA PCIe Slot (PCIE1)
Graphics
•
Intel® UHD Graphics Built-in Visuals and the VGA outputs
can be supported only with processors which are GPU
integrated.
