AT-MZA
Multi Zone Alarm
LEAK DETECTION SOLUTIONS
Weights & Measures House, 20 Barttelot Road,
Horsham, West Sussex RH12 1DQ
+44 (0) 1403 216100
www.aquilar.co.uk
3
Choose a location indoors where the module will be protected from the elements and
temperature extremes
WARNING:
Ignition hazard. Do not mount the MZA unit in a hazardous location. Sensing cable
connected to the MZA may (subject to approvals restrictions) be located in hazardous locations, but
the module itself must
C. SELECT A MOUNTING POSITION
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Remove all six screws attaching motherboard
Figure 1
PREPARE THE MODULE FOR
MOUNTING
Important:
The MZA is an electronic unit.
During installation, take the following
precautions to avoid damage to its electronic
components:
• Handle with care, avoid mechanical
damage.
• Keep the electronics dry.
• If handling circuit boards, hold them by
their edges to avoid physical contact with
electronic components.
• Avoid exposure to static electricity.
•
Avoid contamination with metal filings,
liquids, or other foreign matter.
• Remove the module from its packaging.
•
Open the enclosure door using a flat-blade
screwdriver or coin.
• Anti static precautions should be taken
before touching the boards inside.
• Carefully disconnect the ribbon cable from
the motherboard.
• Unscrew the four Phillips (cross-head)
screws holding the motherboard to
the enclosure (see Fig 1). Remove the
motherboard, and put it out of harm’s way.
• Taking care to protect the User Interface
board on the enclosure door, drill/punch
entries as required (see Fig 2).
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Figure 2
Additional area
avalable for
cable entries
(no knockouts)
MOUNT THE MODULE
The module mounts with four screws with
mounting centers as noted in Fig 3. To seal
around the mounting screw (necessary to
maintain the IP54 rating), use a rubber or
elastomeric washer.
• Note:
The AquiTronTM/ TraceTek sensing
circuit is power limited, so the TraceTek
leader or jumper cable and the power
supply cable must not run in the same
conduit.
• Fit conduit bushings/adapters.
•
Remove all traces of metal filings and dust
from inside the module enclosure.
Figure 2
