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A1101R09x – User’s Manual
Release Date 05/08/12
4.3.
Soldering
AIR Modules may be mounted either manually (for prototyping or low volume production), or
automatically for high-volume production.
A no-clean tin/silver/copper (SAC) solder is recommended, however lead based no-clean
pastes may also be used.
CAUTION:
AIR Modules are designed for no-clean fluxes only. DO NOT use water-
based fluxes that require aqueous cleaning after solder. Spot cleaning with a flux
remover and toothbrush may be performed with care.
4.3.1. Manual Mounting Procedure
The recommended soldering method is reflow of a paste solder on a hot plate. This method
works provided the bottom of the board where the AIR module is to be mounted is accessible,
and there are no bottom-side components in the way.
An aluminum or copper block may be placed on the hot plate surface to transfer heat to a
localized area on the board where the AIR module is mounted
- Set the hot plate to the reflow temperature solder manufacturer’s recommended
- Apply solder paste to the pads on the board receiving the AIR module
- Place the AIR module carefully onto the dispensed solder
- Using tweezers or another holding device, carefully place board with AIR module onto
the hot plate surface (or metal block)
- Apply heat until reflow occurs, per solder paste manufacturer’s recommendations
- Carefully remove the board and place on a heat-resistant surface to cool
- Check assembly electrically to confirm there are no opens or shorts.
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