Rev. D
|
Page 16 of 56
|
November 2008
ADSP-21367/ADSP-21368/ADSP-21369
SPECIFICATIONS
OPERATING CONDITIONS
ELECTRICAL CHARACTERISTICS
Parameter
1
1
Specifications subject to change without notice.
Description
400 MHz
350 MHz
333 MHz
266 MHz
Min
Max
Min
Max
Min
Max
Min
Max
Unit
V
DDINT
Internal (Core) Supply Voltage
1.25
1.35
1.235 1.365
1.14
1.26
1.14
1.26
V
A
VDD
Analog (PLL) Supply Voltage
1.25
1.35
1.235 1.365
1.14
1.26
1.14
1.26
V
V
DDEXT
External (I/O) Supply Voltage
3.13
3.47
3.13
3.47
3.13
3.47
3.13
3.47
V
V
IH
2
2
Applies to input and bidirectional pins: DATAx, ACK, RPBA, BRx, IDx, FLAGx, DAI_Px, DPI_Px, BOOT_CFGx, CLK_CFGx, RESET, TCK, TMS, TDI, TRST.
High Level Input Voltage @ V
DDEXT
= Max
2.0
V
DDEXT
+ 0.5
2.0
V
DDEXT
+ 0.5
2.0
V
DDEXT
+ 0.5 2.0
V
DDEXT
+ 0.5
V
V
IL
2
Low Level Input Voltage @ V
DDEXT
= Min
–0.5
+0.8
–0.5
+0.8
–0.5
+0.8
–0.5
+0.8
V
V
IH
_
CLKIN
3
3
Applies to input pin CLKIN.
High Level Input Voltage @ V
DDEXT
= Max
1.74
V
DDEXT
+ 0.5
1.74
V
DDEXT
+ 0.5
1.74
V
DDEXT
+ 0.5 1.74
V
DDEXT
+ 0.5
V
V
IL
_
CLKIN
3
Low Level Input Voltage @ V
DDEXT
= Min
–0.5
+1.1
–0.5
+1.1
–0.5
+1.1
–0.5
+1.1
V
T
J
Junction Temperature 208-Lead
LQFP_EP @ T
AMBIENT
0
°
C to 70
°
C
N/A
N/A
0
110
0
110
0
110
°
C
T
J
Junction Temperature 208-Lead
LQFP_EP @ T
AMBIENT
–40
°
C to +85
°
C
N/A
N/A
N/A
N/A
–40
+120
–40
+120
°
C
T
J
Junction Temperature 256-Ball BGA_ED
@ T
AMBIENT
0
°
C to 70
°
C
0
95
N/A
N/A
0
105
N/A
N/A
°
C
T
J
Junction Temperature 256-Ball BGA_ED
@ T
AMBIENT
–40
°
C to +85
°
C
N/A
N/A
N/A
N/A
0
105
N/A
N/A
°
C
Parameter
Description
Test Conditions
Min
Typ
Max
Unit
V
OH
1
High Level Output Voltage
@ V
DDEXT
= Min, I
OH
= –1.0 mA
2
2.4
V
V
OL
Low Level Output Voltage
@ V
DDEXT
= Min, I
OL
= 1.0 mA
0.4
V
I
IH
3, 4
High Level Input Current
@ V
DDEXT
= Max, V
IN
= V
DDEXT
Max
10
μA
I
IL
5, 6
Low Level Input Current
@ V
DDEXT
= Max, V
IN
= 0 V
10
μA
I
IHPD
High Level Input Current Pull-Down
@ V
DDEXT
= Max, V
IN
= 0 V
250
μA
I
ILPU
Low Level Input Current Pull-Up
@ V
DDEXT
= Max, V
IN
= 0 V
200
μA
I
OZH
7, 8
Three-State Leakage Current
@ V
DDEXT
= Max, V
IN
= V
DDEXT
Max
10
μA
I
OZL
9
Three-State Leakage Current
@ V
DDEXT
= Max, V
IN
= 0 V
10
μA
I
OZLPU
Three-State Leakage Current Pull-Up
@ V
DDEXT
= Max, V
IN
= 0 V
200
μA
I
DD
-
INTYP
10
Supply Current (Internal)
t
CCLK
= 3.75 ns, V
DDINT
= 1.2 V, 25°C
t
CCLK
= 3.00 ns, V
DDINT
= 1.2 V, 25°C
t
CCLK
= 2.85 ns, V
DDINT
= 1.3 V, 25°C
t
CCLK
= 2.50 ns, V
DDINT
= 1.3 V, 25°C
700
900
1050
1100
mA
mA
mA
mA
AI
DD
11
Supply Current (Analog)
A
VDD
= Max
11
mA
C
IN
12, 13
Input Capacitance
f
IN
= 1 MHz, T
CASE
= 25°C, V
IN
= 1.3 V
4.7
pF
1
Applies to output and bidirectional pins: ADDRx, DATAx, RD, WR, MSx, BRx, FLAGx, DAI_Px, DPI_Px, SDRAS, SDCAS, SDWE, SDCKE, SDA10, SDCLKx, EMU, TDO,
CLKOUT.
2
See
Output Drive Currents on Page 46
for typical drive current capabilities.
3
Applies to input pins without internal pull-ups: BOOT_CFGx, CLK_CFGx, CLKIN, RESET, TCK.
4
Applies to input pins with internal pull-ups: ACK, RPBA, TMS, TDI, TRST.
5
Applies to input pins with internal pull-downs: IDx.
6
Applies to input pins with internal pull-ups disabled: ACK, RPBA.
7
Applies to three-statable pins without internal pull-ups: FLAGx, SDCLKx, TDO.
8
Applies to three-statable pins with internal pull-ups: ADDRx, DATAx, RD, WR, MSx, BRx, DAI_Px, DPI_Px, SDRAS, SDCAS, SDWE, SDCKE, SDA10, EMU.
9
Applies to three-statable pins with internal pull-ups disabled: ADDRx, DATAx, RD, WR, MSx, BRx, DAI_Px, DPI_Px, SDRAS, SDCAS, SDWE, SDCKE, SDA10
10
See
Estimating Power Dissipation for ADSP-21368 SHARC Processors (EE-299)
for further information.
11
Characterized, but not tested.
12
Applies to all signal pins.
13
Guaranteed, but not tested.
