Analog Devices │
12
MAX77831 Evaluation Kit
Evaluates: MAX77831
● Route LX nodes to the corresponding bootstrap
capacitor (C
BST
) as short as possible. Prioritize C
BST
placement to reduce trace length to the IC.
● Connect the inner PGND bumps to the low-impedance
ground plane on the PCB with vias placed next to
the bumps. Do not create PGND islands, as PGND
islands risk interrupting the hot loops. Connect AGND
and AGND island to the low-impedance ground plane
on the PCB (the same net as PGND).
● Keep the power traces and load connections short and
wide. This is essential for high converter efficiency.
● Do not neglect ceramic capacitor DC voltage derat
-
ing. Choose capacitor values and case sizes carefully.
Refer to the Output Capacitor Selection section in the
MAX77831 IC datasheet and
for more
information.
Figure 13. Non-HDI PCB Layout Recommendation (with 4mm x 4mm inductor and without POKB/INTB)
