AD9273
Rev. B | Page 11 of 48
ABSOLUTE MAXIMUM RATINGS
Table 4.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Parameter
With
Respect To
Rating
Electrical
AVDD1
GND
−0.3 V to +2.0 V
AVDD2
GND
−0.3 V to +3.9 V
DRVDD
GND
−0.3 V to +2.0 V
GND
GND
−0.3 V to +0.3 V
AVDD2
AVDD1
−2.0 V to +3.9 V
AVDD2
DRVDD
−2.0 V to +3.9 V
AVDD1
DRVDD
−2.0 V to +2.0 V
Digital Outputs
(DOUTx+, DOUTx−,
DCO+, DCO−,
FCO+, FCO−)
GND
−0.3 V to +2.0 V
CLK+, CLK−, GAIN+,
GAIN−
GND
−0.3 V to +3.9 V
LI-x, LO-x, LOSW-x
LG-x
−0.3 V to +2.0 V
CWDx−, CWDx+
GND
−0.3 V to +3.9 V
PDWN, STBY, SCLK, CSB
GND
−0.3 V to +3.9 V
RBIAS, VREF, SDIO
GND
−0.3 V to +2.0 V
Environmental
Operating Temperature
Range (Ambient)
−40°C to +85°C
Storage Temperature
Range (Ambient)
−65°C to +150°C
Maximum Junction
Temperature
150°C
Lead Temperature
(Soldering, 10 sec)
300°C
THERMAL IMPEDANCE
Table 5.
Airflow Velocity (m/sec)
θ
JA
θ
JB
θ
JC
Unit
0.0 20.3
N/A
N/A
°C/W
1.0 14.4
7.6
4.7
°C/W
2.5 12.9
N/A
N/A
°C/W
1
θ
JA
is for a 4-layer PCB with a solid ground plane (simulated). The exposed
pad is soldered to the PCB.
ESD CAUTION
Summary of Contents for AD9273
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