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MN2-2008
SECTION 2
PRECAUTIONS
2 - 4
2-10
Handling of S.M.D. PCBs
It is an Aloka's policy that neither repair nor modification of PCBs used for S.M.D. is made in the field
as a rule because of the following reasons:
[REMARKS]
PCB does not need repairing or modifying in the field as a rule.
When handling a PCB, do not touch the IC unless it is necessary.
IC soiled with worker’s hands may cause corrosion. Additionally, foreign particles such as fine solder
dust could be the cause of short-circuited IC lead wires whose pitch is smaller than that of the traditional
ones.
#
CAUTION
#
When handling a PCB, avoid touching the IC and connector pins on the
devices to prevent ESD (Electro Static Discharge) damage.
A service person should preferably wear an ESD wrist strap correctly
grounded when handling a PCB.
Do not give excessively large shocks to the PCB.
When replacing the ROM (Read Only Memory) on the PCB, attempting to force the ROM into its
socket would cause the PCB to be subjected to an undue force, and the following faults may :
1)
Damage to PCB intermediate-layer patterns,
2)
Peeling of chip devices (resistor, capacitor, diode, etc.),
3)
Damage to a junction between electrode and internal element of chip devices,
4)
Peeling of patterns (especially those for mounting the parts) together with chip devices since those
patterns are rather fragile compared with PCBs used before now, and
5)
Damage to parts on the reverse side in the case of PCBs of both-side mounting type.
Also, a PCB mounted improperly or a warped PCB mounted as it is may cause the chip devices to come
off and the fine patterns to be cut.
Additionally, reuse of chip devices (including resistors, capacitors, diodes, etc.) is strictly inhibited
because of the following reason:
Since the chip devices are lacking in lead wires, such as those found in the traditional component parts,
heat given to the PCB will be directly conducted to the inside of chip devices.
As a result, a thermal
stress will occur due to a difference in thermal expansion coefficient between each chip device and PCB,
giving rise of the possibility of cracks inside of or on the surface of chip devices or the possibility of
thermal breaking (internal burning).
Very thin wiring patterns require extreme care in handling of the PCB.
Be sure to observe the precautions mentioned above also to prevent the secondary accidents.
Summary of Contents for ProSound Alpha 10
Page 7: ...MN2 2008 Rev 2 SSD ALPHA10 SERVICE MANUAL 6 6 Blank page...
Page 8: ...SECTION 1 SECTION 1 How to use this service manual...
Page 12: ...MN2 2008 SECTION 1 How to use this service manual 1 4 Blank page...
Page 13: ...SECTION 2 SECTION 2 PRECAUTIONS...
Page 20: ...SECTION 3 SECTION 3 Before Repairing...
Page 32: ...MN2 2008 SECTION 3 Before Repairing 3 12 Blank page...
Page 33: ...SECTION 4 SECTION 4 PRINCIPLE OF SYSTEM OPERATION...
Page 57: ...MN2 2008 Rev 2 SECTION 4 Principle of System Operation 4 24 Blank page...
Page 59: ...MN2 2008 Rev 2 SECTION 4 Principle of System Operation 4 26 Blank Page...
Page 63: ...MN2 2008 Rev 2 SECTION 4 Principle of System Operation 4 30 Blank page...
Page 65: ...MN2 2008 Rev 2 SECTION 4 Principle of System Operation 4 32 Blank Page...
Page 69: ...MN2 2008 Rev 2 SECTION 4 Principle of System Operation 4 36 Blank page...
Page 71: ...MN2 2008 Rev 2 SECTION 4 Principle of System Operation 4 38 Blank Page...
Page 75: ...MN2 2008 Rev 2 SECTION 4 Principle of System Operation 4 42 Blank page...
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Page 95: ...MN2 2008 Rev 2 SECTION 4 Principle of System Operation 4 62 Blank Page...
Page 99: ...MN2 2008 Rev 2 SECTION 4 Principle of System Operation 4 66 Blank page...
Page 101: ...MN2 2008 Rev 2 DRAFT SECTION 4 Principle of System Operation 4 68 Blank Page...
Page 105: ...MN2 2008 Rev 2 SECTION 4 Principle of System Operation 4 72 Blank page...
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Page 110: ...MN2 2008 Rev 2 SECTION 4 Principle of System Operation 4 77...
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Page 117: ...MN2 2008 Rev 2 SECTION 4 Principle of System Operation 4 84 Blank Page...
Page 118: ...MN2 2008 Rev 2 SECTION 4 Principle of System Operation 4 85 SSD ALPHA10 Ver 2 Ver 3 M00300...
Page 120: ...MN2 2008 Rev 2 SECTION 4 Principle of System Operation 4 87 SSD ALPHA10 Ver 5 M01051 M01240...
Page 121: ...MN2 2008 Rev 2 SECTION 4 Principle of System Operation 4 88 SSD ALPHA10 Ver 6 M01241 M01705...
Page 122: ...MN2 2008 Rev 2 SECTION 4 Principle of System Operation 4 89 SSD ALPHA10 Ver 6 Ver 7 M01706...
Page 123: ...MN2 2008 Rev 2 SECTION 4 Principle of System Operation 4 90 Blank Page...
Page 127: ...MN2 2008 Rev 2 SECTION 4 Principle of System Operation 4 94 Blank Page...
Page 128: ...MN2 2008 Rev 2 SECTION 4 Principle of System Operation 4 95 SSD ALPHA10 Ver 2 M00200...
Page 131: ...MN2 2008 Rev 2 SECTION 4 Principle of System Operation 4 98 SSD ALPHA10 Ver 6 M01591...
Page 138: ...SECTION 6 SECTION 6 TROUBLESHOOTING...
Page 140: ...MN2 2008 SECTION 6 Troubleshooting 6 2 Blank page...
Page 141: ...SECTION 7 SECTION 7 ADJUSTMENT PROCEDURE...
Page 143: ...MN2 2008 SECTION 7 Adjustment Procedure 7 2 Blank page...
Page 144: ...SECTION 8 SECTION 8 PERFORMANCE CHECK...
Page 165: ...SECTION 9 SECTION 9 DISASSEMBLING PROCEDURE...
Page 170: ...MN2 2008 Rev 2 SECTION 9 Disassembling Procedure 9 5 L KEY 84C...
Page 177: ...MN2 2008 Rev 1 SECTION 9 Disassembling Procedure 9 12 Blank page...
Page 259: ...MN2 2008 Rev 2 SECTION 9 Disassembling Procedure 9 88 6 Blank page...
Page 273: ...MN2 2008 Rev 1 SECTION 9 Disassembling Procedure 9 102 Blank page...
Page 291: ...MN2 2008 Rev 1 SECTION 9 Disassembling Procedure 9 114 Blank page...
Page 307: ...MN2 2008 Rev 2 SECTION 9 Disassembling Procedure 9 124 6 Blank page...
Page 317: ...MN2 2008 Rev 2 SECTION 9 Disassembling Procedure 9 126 8 Blank page...
Page 325: ...MN2 2008 Rev 1 SECTION 9 Disassembling Procedure 9 134 Blank page...
Page 331: ...MN2 2008 Rev 1 SECTION 9 Disassembling Procedure 9 140 Blank page...
Page 348: ...SECTION 10 SECTION 10 PARTS LIST...
Page 355: ...MN2 2008 Rev 2 SECTION 10 Parts List 10 7 01 MAIN BODY USI 153 S N 19 20 18 61...
Page 357: ...MN2 2008 Rev 2 SECTION 10 Parts List 10 9 01 MAIN BODY USI 153 S N 54 53 PCB 29 52...
Page 364: ...MN2 2008 Rev 2 SECTION 10 Parts List 10 16 02 OPERATION PANEL L KEY 84 S N 21 10 CTRL PCB...
Page 371: ...MN2 2008 Rev 2 SECTION 10 Parts List 10 23 Blank page...
Page 372: ...MN2 2008 Rev 2 SECTION 10 Parts List 10 24 03 CABLE HANGER L KI 630V S N 1...
Page 380: ...MN2 2008 Rev 2 SECTION 10 Parts List 10 32 05 JUNCTION BOX JB 273 JB 274 S N 1 5 4 3 6 2...
Page 395: ...MN2 2008 Rev 2 SECTION 10 Parts List 10 47 Blank page...
Page 398: ...MN2 2008 Rev 2 SECTION 10 Parts List 10 50 09 MONITOR IPC 1710 S N M00101 M01590 2 1 4 3 5...