Alesis IO|2, Service Manual

Page: 23 / 108

UB0MNF - Main PCB Rev F
Last Revised:
RevChange Document
3/17/2006
SCH PCB CAM
Suggested
by:
DATE
Performed
by:
DATE Description of change: Reason for change:
TOP LEVEL CHANGES
x x SOP 3/13/2006 JK 3/17/2006 Change all text from Rev E to F SOP
SOP 3/13/2006 update all Part Types SOP
SOP 3/13/2006 Review/Integrate all outstanding ECNs SOP
Note: ***A new solderpaste stencil IS NOT required*** No SMD components were moved.
SCHEMATIC CHANGES
PCB CHANGES
x JK 3/14/2006 JK 3/17/2006 Flood power plane.
x YH 3/16/2006 JK 3/16/2006
The bottom layer pads of C75's negative terminal and
C76's positive terminal are too close.
x YH 3/16/2006 JK 3/16/2006
The bottom layer pads of C43's negative terminal and
C44's positive terminal are too close.
x YH 3/16/2006 JK 3/16/2006
The bottom layer pads of C57's negative terminal and
C68's positive terminal are too close.
x YH 3/16/2006 JK 3/16/2006
The bottom layer pad of C40's negative terminal is too
close to C41's +3.3V via.
x YH 3/16/2006 JK 3/16/2006
The bottom layer pad of C60's negative terminal is too
close to one of R68's pads.
The leads of the thru-hole components at these locations, after
being bent during the auto-insertion process (to prevent the
components from falling out), tend to short out against the
neighboring pads during the wave-solder process.