72
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
IC, CXD2652AR
Pin No.
Pin Name
I/O
Description
MNT0
MNT1
MNT2
MNT3
SWDT
SCLK
XLAT
SRDT
SENS
XRST
SQSY
DQSY
RECP
XINT
TX
OSCI
OSCO
XTSL
NC
DVSS
DIN
DOUT
ADDT
DADT
LRCK
XBCK
FS256
DVDD
A03
A02
A01
A00
A10
A04
A05
A06
A07
Monitor output terminal.
Monitor output terminal.
Monitor output terminal.
Monitor output terminal.
Microprocessor serial interface data input.
Microprocessor serial interface shift clock input.
Microprocessor serial interface latch input. Latched at falling down edge.
Microprocessor serial interface data output.
The terminal which outputs internal status in accordance with the address of the
microprocessor serial interface.
Reset input. L: reset.
Disc sub code Q sync/ADIP sync output.
Subcode Q sync output of U-bit CD or MD format when the DIGITAL IN source is
CD or MD.
Laser power selection input. H: Recording power, L: Playback power.
Interrupt request output terminal. L is output when interrupt status is generated.
Record data output enable signal input terminal. H: enable.
Crystal oscillator circuit input terminal.
Crystal oscillator circuit output terminal. (Inverted output of OSCI).
OSCI terminal input frequency selection. H: 512 Fs (22.5792 MHz), L: 1024 Fs
(45.1584 MHz).
Not connected.
Digital GND.
Digital audio interface signal input.
Digital audio interface signal output.
Analog recording signal input terminal. (External A/D converter output is connected to
this terminal).
RECORD monitor output/decode audio data output.
LRCK (44.1 kHz) output terminal to external audio block.
Bit clock output (2.8224 kHz) output terminal to external audio block.
256 Fs output. (11.2896 MHz).
Digital power supply.
Address output to external DRAM.
Address output to external DRAM.
Address output to external DRAM.
Address output to external DRAM.
Address output to external DRAM. (Not used).
Address output to external DRAM.
Address output to external DRAM.
Address output to external DRAM.
Address output to external DRAM.
O
O
O
O
I
I
I
O
O
I
O
O
I
O
I
I
O
I
—
—
I
O
I
O
O
O
O
—
O
O
O
O
O
O
O
O
O
Summary of Contents for XR-MD200
Page 6: ...6 DISASSEMBLY INSTRUCTIONS 1 Remove the two screws 2 Remove the two screws 1 2 ...
Page 13: ...14 13 BLOCK DIAGRAM IC301 LC866532A ...
Page 14: ...1 2 3 4 5 6 7 8 9 10 11 12 13 14 A B C D E F G H I J K 16 15 WIRING 1 POWER AMP AC 230V 50Hz ...
Page 15: ...18 17 SCHEMATIC DIAGRAM 1 POWER AMP Q261 262 MUTE R261 22k R262 22k 220k 220k 1000p 1000p ...
Page 16: ...1 2 3 4 5 6 7 8 9 10 11 12 13 14 A B C D E F G H I J K 20 19 WIRING 2 FRONT ...
Page 17: ...22 21 SCHEMATIC DIAGRAM 2 FRONT IC301 LC866532A 5L31 ...
Page 28: ...40 39 BLOCK DIAGRAM 1 CD ...
Page 29: ...42 41 BLOCK DIAGRAM 2 MD TO MAIN C B CN502 TO CD C B CN6 ...
Page 30: ...44 43 WIRING 1 CD 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H I J CD C B COMPONENT SIDE ...
Page 31: ...46 45 1 2 3 4 5 6 7 8 9 10 11 12 13 14 A B C D E F G H I J TP3 CD C B CONDUCTOR SIDE ...
Page 32: ...48 47 SCHEMATIC DIAGRAM 1 CD 1 2 DTC114TK ...
Page 33: ...50 49 SCHEMATIC DIAGRAM 2 CD 2 2 RESET 5M36 ...
Page 34: ...1 2 3 4 5 6 7 8 9 10 11 12 13 14 A B C D E F G H I J K 52 51 WIRING 2 FUNCTION ...
Page 35: ...54 53 SCHEMATIC DIAGRAM 3 FUNCTION ...
Page 59: ...81 IC BA5936 Rog CURRENT DETECTOR TERMINAL IC BA5970FP IC BA6417F ...
Page 60: ...82 IC BD7910FV IC AK4519VF ...
Page 72: ...931196 Printed in Singapore 2 11 IKENOHATA 1 CHOME TAITO KU TOKYO 110 JAPAN TEL 03 3827 3111 ...
