Advantech MIC-3332, User Manual, Page: 16 / 62

MIC-3332 User Manual 6
1.2.13 Optional Extension Modules
MIC-3332 has two kinds of second layer. One 8HP XTM-1 is used for multi-display
applications and also other rich I/O features; Another 8HP XTM-2 is used for multi-
Ethernets applications. XTM connectivity is described in the list below. For a custom -
ized extension module demand, please contact Advantech local sales.
1.2.14 Mechanical and Environmental Specifications

Operating temperature: 0 ~ 55 °C (-32 ~ 131 °F)

Storage Temperature:
-40 ~ 85 °C (-40 ~ 185 °F)

Humidity: 95% @ 40 °C (non-condensing)

Humidity (Non-operating):
95% @ 60 °C (non-condensing)

Vibration: 5~100Hz, 2Grms (without on-board 2.5" SATA HDD)

Shock:
10G (without on-board 2.5" SATA HDD)

Board size: 100 x 160 x 40.64 mm (3U size)

Weight:
3U 8HP FIO Board: 0.84 kg
3U 4HP REAR IO Board (MIC-3332R1-S1E): 0.15kg
1.2.15 Compact Mechanical Design
Forced-air cooling in the chassis is recommended for MIC-3332 board to optimize its
system stability and reliability even though there is a special Cu-designed heatsink
assembled in unit already.
1.2.16 Hardware Monitor
For HWM management system in MIC-3332 series, In order to monitor processor
temperature and core voltage information.
NCT7802Y is connected to SMBUS interface.
NCT7902D is optional function on MIC-3332 SKUs with 8HP XTM-1 board based on
customer request, and used for FAN speed monitor and alarms.
NCT5523D also has optional functions on MIC-3332 SKUs with 8HP XTM-1 board
based on customer request.
1.2.17 Super I/O
MIC-3332 Super I/O device can enable or disable serial ports, and you can select the
serial port mode RS232/RS422/RS485 by jumper setting. For the details, please
check item 1.4.
Table 1.3: The Second Layer 8HP XTM Configurations
8HP XTM
IO Panel
On-board Header/
Socket/Connector
LAN
(RJ45/M12) COM
HDMI USB3.0 SATA Cfast
Micro-
SD
COM
8HP XTM-1 board 2 1 1 1 1 1 0 1
8HP XTM-2 board 4 0 0 0 1 1 1 0
Note!
The operating temperature range of the MIC-3332 depends on the
installed processor and the airflow through the chassis.