6
Introduction
Mechanical Specifications
Vibration Step Stress
The board was subject to vibration step stress with set
points from 5 grams to 45 grams @ 20°C and vibration
increasing by 5 grams with 15 minute dwells at each
level of 2Hz to 5000Hz bandwidth
Combined Environment
The board was subject to thermal cycles from -90°C to
+85°C at an average rate of 60°C per minute combined
with vibration at set points of 8, 16, 24, 32, and 40
grams from the first to the fifth thermal cycle and
10-minute dwells at each extreme temperature
Table 1-7: Mean Time Between Failures
MTBF at 40°C
1,246,692 Hrs
Table 1-8: Mechanical
Dimensions (L x W)
90.6mm x 95.2mm
Height
Max. 31mm on top side above PCB (including heat-
sink)
Weight
98 grams (without MiniPCIe extension card)
Mounting
4 mounting holes
ADLINK strongly recommends plastic spacers instead of metal spacers for
mounting the board. Metal spacers create the possibilities of short circuits
with the components located around the mounting holes. This can damage
the board.
Table 1-6: HALT Parameters (Continued)
Summary of Contents for CM1-86DX2
Page 6: ...vi ...
Page 20: ...14 Getting Started ...
Page 26: ...20 Module Description LVDS Color Mapping ...
Page 52: ...46 Using the Module ...
Page 53: ...Using the Module 47 CM1 86DX2 PCIPnP ...
Page 54: ...48 Using the Module ...
Page 56: ...50 Using the Module Chipset screen ...
Page 57: ...Using the Module 51 CM1 86DX2 ...
Page 58: ...52 Using the Module ...
Page 59: ...Using the Module 53 CM1 86DX2 Security screen ...