7
The parameters of
A
CHI
®
IR6500
BGA Rework Station
Basic Parameters
Heating
IR
Dimension
L 475mm
mm
mm
Weight
15kg
Total weight
About 17 kg, vary with the differen need of the users
Electrical Parameters
Power
220V AC
Upper Heating
IR
Size of Upper heating
80mm
mm
Consumption of upper heating 400W
Bottom Heating
IR
Size of Bottom heating
180 mm
mm
Consumption of Bottom
heating
800W
General power
1250W
Temperature Control
Control mode of Upper
Independent temperature control, high-precision closed-loop
control, precision ± 0.5%, Alarm
Control mode of Bottom
Independent temperature control, high-precision closed-loop
control, precision ± 0.5%, NO Alarm
Rework Function
SMD
Suit for welding, remove or repair packaged devices
such as BGA,PBGA,CSP,multi-layer substrates
EMI
metallic shield product and solder/lead free Rework
welding
Size of
applicable
chips
70mm
70 mm
Size of
applicable
PCB
400mm
mm
