18
Prompt
1
Installed the equipment in stable work platform to use where the air mobility should be small
as possible .Avoid it closing to air conditioners, fans and the other outlet.
2
A
CHI
®
IR6500
Rework Station sensor Direct contact with motherboard
So Temperature
display is Actual temperature
3
In order to avoid damage to the motherboard capacitor
SO use insulation tape please
Maintenance completed ,then Removal of insulation tape
So as to avoid short-circuit
4
After removal of BGA chip
PCB Bonding Pad Need to clean up
Avoid cold solder joint
See BGA chip tin completely liquefied, Then To move the BGA chip
So as to avoid Bonding
Pad Damage
5
BGA chips should be subject to settlement, floating state Prohibited in all solder ball did not
fully liquefied, by force if removal of chips, so as to avoid pad off, chip or motherboard
scrap!
6
To improve success rate of Rework , PCB and chips need drying and processing in principle
PCB board or chip moist heat process will occur in the burst phenomenon, the Rework
process may hear the blasting sound of a minor
According to actual situation Please
self-control.
7
PCB board heating time is too long or repeated several times the surface heating will lead to
discoloration.
8
Users from modifying temperature parameters
Please use scrap PCB tested
Heating whole
time about 10 seconds before the end of solder balls should be fully liquefied
f the
liquefaction advanced or delayed,
Should be regulating up/down the temperature setting.
So as to avoid heat damage to chips or low-temperature sealing-off
9
The factory equipped with two sets of programmable temperature control table used
parameters:
!
!
!
!
Rework temperature curve to set examples
" # $ % & % '
" # $ % & % '
" # $ % & % '
" # $ % & % '
r1
1
L1
85
d1
70
r2
1
L2
150
d2
35
r3
1
L3
190
d3
50
r4
END
Hb
230
!
!
!
!
" # ( $ ) * + , % - . / ) *
" # ( $ ) * + , % - . / ) *
" # ( $ ) * + , % - . / ) *
" # ( $ ) * + , % - . / ) *
r1
1
L1
85
d1
80
r2
1
L2
140
d2
60
r3
1
L3
220
d3
65
r4
END
Hb
230
