v
T
A B L E O F
C
O N T E N T S
1.
INTRODUCTION
............................................................................................................................... 1
2.
UNPACKING AND SETUP
......................................................................................................... 3
2.1
VISUAL INSPECTION ..................................................................................................................................... 3
2.2
CARRYING CASES LAYOUT......................................................................................................................... 4
3.
HARDWARE STARTUP
............................................................................................................... 5
3.1
CONNECTOR PLATES .................................................................................................................................... 5
3.2
INSTALLATION OF THE DSP BOARD IN THE HOST COMPUTER ....................................................... 10
3.3
PUTTING THE BASIC SYSTEM TOGETHER............................................................................................. 11
4.
SOFTWARE STARTUP
............................................................................................................... 14
4.1
S
OFTWARE INSTALLATION
................................................................................................................................ 14
4.2
E
DITING THE CONFIGURATION FILE
(A
CQUIRE
.
CFG
) ......................................................................................... 16
4.2.1
Changing the instrument type................................................................................................................... 16
4.2.2
Running Research Acquire without instrument ........................................................................................ 16
4.2.3
External Trigger address setting .............................................................................................................. 17
5.
SHUTDOWN SEQUENCE AND SYSTEM PACKING
....................................... 17
6.
HANDLING AND CARE OF HYGROSCOPIC MATERIALS
.................... 19
6.1
INTRODUCTION ............................................................................................................................................ 19
6.2
HYGROSCOPIC MATERIALS ...................................................................................................................... 19
6.3
HANDLING AND CARE................................................................................................................................ 21
6.3.1
Handling of components........................................................................................................................... 21
6.3.2
Storage conditions .................................................................................................................................... 21
6.3.2.1
Optical materials..................................................................................................................................................... 21
6.3.2.2
Instrumentation....................................................................................................................................................... 22
6.3.3
Transport conditions ................................................................................................................................ 22
6.4
RELATIVE HUMIDITY ................................................................................................................................. 22
6.5
CONCLUSION ................................................................................................................................................ 24
