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Hardware Development Guide of Module Product

ZTE MG2618

SMT PROCESS AND BAKING GUIDE .................................................................................. 28

6.1  STORAGE REQUIREMENTS.......................................................................................... 28
6.2  RECOMMENDED PAD DESIGN .................................................................................... 28
6.3  REQUIREMENTS OF MODU

LE’S POSITION ON MAI

N BOARD ............................. 30

6.4 MODULE PLANENESS STANDARD ............................................................................ 31
6.5 PROCESS ROUTING SELECTION ................................................................................. 31

6.5.1 SOLDER PASTE SELECTION.............................................................................. 31
6.5.2 DESIGN OF MODULE PA

D’S STEEL MESH OPENI

NG ON MAIN BOARD . 31

6.5.3

MODULE BOARD’S SMT P

ROCESS .................................................................. 32

6.5.4  MODULE SOLDERING REFLOW CURVE ........................................................ 33
6.5.5  REFLOW METHOD .............................................................................................. 34
6.5.6  MAINTENANCE OF DEFECTS ........................................................................... 34

6.6

MODULE’S BAKING RE

QUIREMENTS ....................................................................... 35

6.6.1

MODULE’S BAKING ENVI

RONMENT .............................................................. 35

6.6.2 BAKING DEVICE AND OPERATION PROCEDURE ........................................ 35
6.6.3 MODULE BAKING CONDITIONS ...................................................................... 35

SAFETY INFORMATION ........................................................................................................ 36

Содержание MG2618

Страница 1: ...Hardware Development Guide of Module Product ZTE MG2618 Version 1 0 2015 03 18 Welink Your Smart ...

Страница 2: ...logo and product names referenced herein are either trademarks or registered trademarks of ZTE CORPORATION Other product and company names mentioned herein may be trademarks or trade names of their respective owners Without the prior written consent of ZTE CORPORATION or the third party owner thereof anyone s access to this document should not be construed as granting by implication estopped or ot...

Страница 3: ...Hardware Development Guide of Module Product All Rights reserved No Spreading abroad without Permission of ZTE II ZTE MG2618 Revision History Version Date Description V1 0 2015 03 18 1st released ...

Страница 4: ...ES 10 3 1 INTERFACE POWER LEVEL 10 3 2 POWER CONSUMPTION 10 3 3 POWER ON OFF TIMING SEQUENCE 11 3 4 RELIABILITY TEST 11 3 5 ESD CHARACTERISTIC 12 3 6 GPS PERFORMANCE 12 4 REFERENCE CIRCUIT OF MODULE INTERFACES 13 4 1 RESET AND POWER DESIGNING 13 4 2 UART INTERFACE 15 4 2 1 DUPLEX UART INTERFACE 17 4 3 SIM CARD INTERFACE 18 4 4 AUDIO INTERFACE 19 4 5 LED INDICATOR INTERFACE 22 4 6 GPS INTERFACE 22 ...

Страница 5: ...0 6 4 MODULE PLANENESS STANDARD 31 6 5 PROCESS ROUTING SELECTION 31 6 5 1 SOLDER PASTE SELECTION 31 6 5 2 DESIGN OF MODULE PAD S STEEL MESH OPENING ON MAIN BOARD 31 6 5 3 MODULE BOARD S SMT PROCESS 32 6 5 4 MODULE SOLDERING REFLOW CURVE 33 6 5 5 REFLOW METHOD 34 6 5 6 MAINTENANCE OF DEFECTS 34 6 6 MODULE S BAKING REQUIREMENTS 35 6 6 1 MODULE S BAKING ENVIRONMENT 35 6 6 2 BAKING DEVICE AND OPERATIO...

Страница 6: ...Figure 4 8 SPK reference circuit 21 Figure 4 9 Reference Circuit of Status Indicator 22 Figure 4 10 Reference Circuit of GPS Interface 23 Figure 4 11 Active GPS antenna circuit reference design principle diagram 23 Figure 5 1 Top bottom side view of module 24 Figure 5 2 The assembly diagram of module 25 Figure 5 3 The PCB package dimensions of module Top View 26 Figure 5 4 Test point of module 27 ...

Страница 7: ...e 3 1 Power Level Range of Digital Signal 10 Table 3 2 Power Consumption of Module Typical 10 Table 3 3 Module testing environment of temperature 11 Table 3 4 ESD Endurance 12 Table 3 5 GPS Performance 12 Table 4 1 Working Condition 13 Table 4 2 UART Interface Definition 17 Table 4 3 Definition of SIM Card Signal 18 Table 4 4 Audio interface definition 19 Table 4 5 Definition of LED Indicator Stat...

Страница 8: ... cases assessment of the final product must be mass against the Essential requirements of the R TTE Directive Articles 3 1 a and b safety and EMC respectively as well as any relevant Article 3 3 requirements Hereby ZTE CORPORATION declares that this product is in complies with the essential requirements of Article 3 of the R TTE 1999 5 EC Directive ...

Страница 9: ...adiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment This equipment should be installed and operated with minimum distance 20cm between the radiator your body End Product Labeling The final end product must be labeled in a visible area with the following Contains FCC ID SRQ ZTEMG2618 The grantee s FCC ID can be used only w...

Страница 10: ...s vehicle mounted terminals and electric devices by providing data services transceiver Email web browsing high speed download and so on In places with GSM network coverage you can send and receive SMS use high speed data access service voice calls and other functions under the mobile environment The module provides users with a high degree of freedom convenient solution to realize mobile office d...

Страница 11: ... Interface AT commands data transmission SIM card Interface 1 8V 3V Data Service Service GPRS Class A or B Class 10 or 12 GPRS Mobile station Class C GPRS class Class 12 Max DL Data rate 85 6Kbps Max UL Data rate 42 8Kbps Protocols Embedded TCP IP and UDP IP protocol stack TCP Server UDP Server Embedded FTP SMS Support TEXT PDU mode Point to point MO MT SMS Cell Broadcast AT Commands Static AT com...

Страница 12: ...bove 1 3 Abbreviations Table 1 3 Abbreviation List A ADC Analog Digital Converter 模数转换 AFC Automatic Frequency Control 自动频率控制 AGC Automatic Gain Control 自动增益控制 ARFCN Absolute Radio Frequency Channel Number 绝对射频信道号 ARP Antenna Reference Point 天线参考点 ASIC Application Specific Integrated Circuit 专用集成电路 B BER Bit Error Rate 比特误码率 BTS Base Transceiver Station 基站收发信台 C CDMA Code Division Multiple Access ...

Страница 13: ...tro Magnetic Interference 电磁干扰 ESD Electronic Static Discharge 静电放电 ETS European Telecommunication Standard 欧洲通信标准 F FDMA Frequency Division Multiple Access 频分多址 FR Full Rate 全速率 G GPRS General Packet Radio Service 通用分组无线业务 GSM Global Standard for Mobile Communications 全球移动通讯系统 H HR Half Rate 半速率 I IC Integrated Circuit 集成电路 IMEI International Mobile Equipment Identity 国际移动设备标识 ISO International S...

Страница 14: ...ead only Memory 只读存储器 RTC Real Time Clock 实时时钟 S SIM Subscriber Identification Module 用户识别卡 SMS Short Message Service 短消息服务 SRAM Static Random Access Memory 静态随机访问存储器 T TA Terminal adapter 终端适配器 TDMA Time Division Multiple Access 时分多址 TE Terminal Equipment also referred it as DTE 终端设备也指 DTE TTFF Time To First Fix 首次定位时间 U UART Universal asynchronous receiver transmitter 通用异步接收发送器 UIM User Identi...

Страница 15: ...p internally more information please refer to 4 1 4 GND GND 5 AUDIO HSED BIAS O MIC bias Default is 1 9V 6 AUDIO MIC1_P I Differential audio input channel 1 anode 7 AUDIO MIC1_N I Differential audio input channel 1 cathode 8 AUDIO MIC2_P I Single end audio input channel 2 9 AUDIO SPK2_P O Single end audio output channel 2 10 AUDIO SPK1_P O Differential audio output channel 1 anode 11 AUDIO SPK1_N ...

Страница 16: ...ive low 28 UART RXD I Receiving data from serial port 2 8V active low 29 NC NC 30 GND GND 31 UART DCD O Carrier detection 2 8V active low 32 UART DSR O Data is ready 2 8V active low 33 UART RI O Ring tone 2 8V active low 34 UART DTR I Data terminal is ready 2 8V active low 35 NC NC 36 GND GND 37 GND GND 38 ANT GPS_ANT I GPS antenna Module without GPS function this pin should not be connected 39 GN...

Страница 17: ...ain Generally the larger in band gain and smaller out band gain the better performance the antenna has Isolation among ports must more than 30dB when multi ports antenna is used For example between two different polarized ports on dual polarized antenna or two different frequency ports on dual frequency antenna or among four ports on dual polarized dual frequency antenna the isolation should be mo...

Страница 18: ...Uplink Frequency Band MS BTS Downlink Frequency Band BTS MS Max Transmitter Power dBm Receiving sensitivity T ypical GSM850 824MHz 849MHz 869MHz 894MHz 33 2 dBm 108dBm EGSM900 880MHz 915MHz 925MHz 960MHz 33 2 dBm 108dBm DCS1800 1710MHz 1785MHz 1805MHz 1880MHz 30 2 dBm 106dBm PCS1900 1850MHz 1910MHz 1930MHz 1990MHz 30 2 dBm 106dBm ...

Страница 19: ... 0 3 VREG_SIM 1 8V 3 0V 0 7 VREG_SIM VREG_SIM 1 1 VREG_SIM The high power level of UART1 is 2 8V VREG_SIM is 1 8V 3V automatic adaptation 3 2 Power Consumption Table 3 2 Power Consumption of Module Typical Test Items Test condition Test duration 1min Test result Unit GSM GPS Max Min Average Standby sleep current Standby The kernel is running but not working properly 47 46 30 32 31 16 mA Standby ON...

Страница 20: ... working in fact the module is in the state of part dormant and the part related to GPS is still working 3 3 Power on off timing sequence The timing sequence of module shows entire process of power on off Figure 3 1 Power on off timing sequence 3 4 Reliability Test The reliability test of module includes the items as follows High low temperature operation high low temperature storage thermal shock...

Страница 21: ... normal temperature are shown as the following table Table 3 4 ESD Endurance Interface Test program Test requirements Antenna Interface Air discharge 8 kV Contact discharge 8 kV SIM Interface Air discharge 8 kV Contact discharge 6 kV 3 6 GPS Performance Table 3 5 GPS Performance Test Items Working mode Typical CNR 130dBm 40 Sensitivity dBm Tracking 162 Cold start 145 5 Warm start 159 5 TTFF 130 dB...

Страница 22: ... The power on time of module is related to module status it s usually required low level for more than 2 5S Power off To turn off the module provide a 3s low level pulse to the ON OFF PIN Reset If the external reset function has to be used provide a low level pulse lasting 100ms to the RESET PIN to reset the module After resetting the module will enter power off state and you need to provide a low...

Страница 23: ...eference For details please adjust according to the actual circuit Power supply VD1 TVS C1 C2 22uf C3 100uf VT1 R1 15k Power supply for module VBAT C4 0 1uf Buffer start circuit MCU_ON OFF R2 4 7K MCU_RESET RESET ON OFF R3 4 7K Figure 4 1 Reference Circuit of Power Supply Reset Interface R5 2 2K R6 1K C6 0 1uF C8 100uF C7 0 1uF R4 10K C5 10uF D1 MIC29302 GND TAB SHUT IN OUT SENSE Voltage input Pow...

Страница 24: ...s serial interface for AT commands data service and the default baud rate is adaptive 2 The module s UART output I O level is 2 8V therefore it needs level conversion when connecting with 3 3V or 5V logic circuit Otherwise it would be damaged or unstable by the mismatch of power level For example if MCU communication with module through UART interface and the MCU UART level is 3 3V the most common...

Страница 25: ... 2 8V TXD 2 8V 10K 1K VCC 3 3V TX 3 3V 22pF 10K RX 3 3V 100pF RXD 2 8V VREG_MSME1 2 8V Figure 4 4 Reference Circuit 2 of UART Interface 3 When the module need to enter sleep mode pull up the pin DTR to high level and when you want to wake up the module pull down the DRT pin to low level 4 When there is a call a low level is output from PIN RI and lasting until the end of conversation ...

Страница 26: ... definition is shown in Table below Table 4 2 UART Interface Definition Function PIN Definition I O Description Remark UART 25 RTS O Ready to send DTE informs DCE to send 26 CTS I Clear to send DCE has switched to Rx mode 27 TXD O Transmitting data DTE receives serial data 28 RXD I Receiving data DTE transmits serial data 31 DCD O Carrier detection Data link connected 32 DSR O Data set ready DCE i...

Страница 27: ...ess than 100mm which might seriously distort the waveform and thus affect the signal integrity The distance between the module and headset handset should be as short as possible and it s enveloped by the ground wires to avoid strong interference sources It is recommended to make the grounding protection for SIM_CLK and SIM_DATA signal wiring Cascade one 1uF capacitor between VREG_SIM and GND anoth...

Страница 28: ...des 2 Speaker interfaces and 2 Microphone interfaces Only one pair I O works at the same time Table 4 4 Audio interface definition Function PIN Definition I O Description Remark AUDIO 7 MIC1_N I Differential audio input channel 1 cathode Differential input 6 MIC1_P I Differential audio input channel 1 anode 11 SPK1_N O Differential audio output channel 1 cathode Differential output 10 SPK1_P O Dif...

Страница 29: ...rdware Development Guide of Module Product All Rights reserved No Spreading abroad without Permission of ZTE 20 ZTE MG2618 See the audio reference circuit in Figure below Figure 4 7 MIC reference circuit ...

Страница 30: ... reach 51 5dB The voltage level of MIC1_P is about 1 9V NOTE If other kind of audio input method is adopted the input signal should be within 0 5V If the signal voltage is lower than this value then the pre amplifier should be added If the signal voltage is higher than this value then attenuation network should be added Design of audio interface on the earpiece The output power of SPK2 is 10 8 mW ...

Страница 31: ...ED is off Network searching state the LED blinks at 3Hz 3Hz Idle sleep state the LED blinks at 1Hz 1Hz Traffic state call data the LED blinks at 5Hz 5Hz The output status of RSSI_LED pin is decided by the software of module and it s the GPIO pin the driver ability is limit It can t drive the LED directly and it need to work with transistor The figure below is the reference of circuit Figure 4 9 Re...

Страница 32: ... above name the MCU control signal of LDO as GPS_EN which connected with MCU to control the power supply for GPS The GPS chip can t work independently and it need to work with the GSM module together to output the valid location information The GPS data output from UART interface 4 7 Connection Method of GPS Active Antenna This chapter can be only applied by the modules support GPS function In the...

Страница 33: ...ights reserved No Spreading abroad without Permission of ZTE 24 ZTE MG2618 5 Mechanic Features 5 1 Appearance diagram Figure 5 1 Top bottom side view of module Note The figure above is just for reference please take the actual products as the reference ...

Страница 34: ...erved No Spreading abroad without Permission of ZTE 25 ZTE MG2618 5 2 Assembly Diagram See the assembly diagram of module in Figure below Unit mm Figure 5 2 The assembly diagram of module Dimensions Length Width Thickness 22 00mm 20 00mm 2 0mm Weight About 1 9g ...

Страница 35: ...reserved No Spreading abroad without Permission of ZTE 26 ZTE MG2618 5 3 PCB Package Dimensions The PCB package dimensions of module are shown in Figure below Unit mm Figure 5 3 The PCB package dimensions of module Top View PIN1 PIN49 PIN18 PIN19 PIN36 PIN37 ...

Страница 36: ...Permission of ZTE 27 ZTE MG2618 Figure 5 4 Test point of module Precaution during PCB designing 1 Copper clad and wiring are forbidden in the nearby areas of the RF stamp hole 2 For the convenience of testing and maintenance it is recommended to drill holes on the PCB to expose JTAG test points ...

Страница 37: ...ming to IPC JEDEC J STD 020 After opening the package mount within 168 hours under the environment conditions of temperature 30 relative humidity 60 RH if it doesn t meet the above requirements perform the baking process See the baking parameters in Table below Table 6 1 Baking parameters Temperature Baking conditions Baking time Remarks 125 5 Moisture 60 RH 8 hours The accumulated baking time mus...

Страница 38: ...hts reserved No Spreading abroad without Permission of ZTE 29 ZTE MG2618 Figure 6 1 Module s dimensions Figure 6 2 Recommended PAD dimensions on corresponding main board t2 Main board s PAD extend inward t1 Main board s PAD extend outward LCC module PAD ...

Страница 39: ...2 P When H 1mm and P W 0 5mm 0 5mm 0 05mm min 0 1mm max W min W 0 2mm max L 2 t1 S 2 t2 P 6 3 Requirements of Module s Position on Main board It is recommended that the thickness of green oil at the module s position on main board should be less than 0 02mm Do not cover with white oil or cover white oil on the green oil layer to avoid excessive thickness As the excessive thickness may cause the mo...

Страница 40: ...s cleaning is used we cannot guarantee the components on the module board could withstand the washing of the cleaning solvents This might cause the functional problems of such components and affect the appearance of the module During the printing process make sure the solder paste s thickness at the position of module s PAD is within 0 18mm 0 20mm 6 5 2 Design of module PAD s steel mesh opening on...

Страница 41: ... 5mm Contract 0 05 0 1mm in the direction of width Contract 0 05 0 1mm inward in the direction of length extend 0 5mm outward in the direction of length Figure 6 5 Module Board s Steel Mesh Diagram 6 5 3 Module Board s SMT process 1 SMT Pallets The pallets which are suitable for SMT have been made for most ZTE modules If the module has provided the pallets itself and meets the SMT requirements cus...

Страница 42: ...er to ensure a good contact between the module and the solder paste on main board the pressure of placing the module board on main board should be 2 5N according to our experiences Different modules have different numbers of pads therefore the pressure selected are different Customers can select proper pressure based on their own situations to suppress the module paste as little as possible in ord...

Страница 43: ...commended to mount the module board at the second time In addition it is preferable for the main board to reflow on the mesh belt when mounting at the first time and the second time If such failure is caused by any special reason the fixture should be also used to make such main board reflow on the track so as to avoid the deformation of PCB during the reflow process 6 5 6 Maintenance of defects I...

Страница 44: ...ent requirements The product s transportation storage and processing must conform to IPC JEDEC J STD 033 6 6 2 Baking device and operation procedure Baking device any oven where the temperature can rise up to 125 C or above Precautions regarding baking during the baking process the modules should be put in the high temperature resistant pallet flatly and slightly to avoid the collisions and fricti...

Страница 45: ...h other electronic devices in environments such as hospitals aircrafts airports etc switch off before boarding an aircraft Make sure the cellular terminal is switched off in these areas The operation of wireless appliances in the hospitals aircrafts and airports are forbidden to prevent interference with communication systems Areas with potentially explosive atmospheres including fuelling areas be...

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