Zte MG2618, Руководство по оборудованию

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Hardware Development Guide of Module Product
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ZTE MG2618
Figure 6
–
3
Module board’s PAD mounted on main board
Refer to the recommended PAD dimensions of main board at client end in the table below:
Table 6
–
2 Recommended PAD dimensions of main board
Limited
conditions of
module board’s
dimensions
Main board’s recommended PAD dimensions
Y1=T1+t1+t2
X Z G e
/ t1 t2
When H<1mm,
P-W<0.5mm
T1
H/2 0.05mm W L+2*t1 S-2*t2 P
When H<1mm
P-
W≥0.5mm
H/2 0.05mm
W(min)
(W+0.2mm)(max)
L+2*t1 S-2*t2 P
When
H≥1mm,and
P-W<0.5mm
0.5mm
0.05mm(min)
0.1mm(max)
W L+2*t1 S-2*t2 P
When
H≥1mm,and
P-
W≥0.5mm
0.5mm
0.05mm(min)
0.1mm(max)
W(min)
(W+0.2mm)(max)
L+2*t1 S-2*t2 P
6.3
Requirements of Module’s Position on Main board
It is recommended that the thickness of green oil at the module’s position on main board should be
less than 0.02mm. Do not cover with white oil or cover white oil on the green oil layer to avoid excessive
thickness. As the excessive thickness may cause the module cannot be effective contact with the solder
paste thus affecting the quality of welding.
Figure 6
–
4
Green oil and white oil at module’s position on main board
(The figure is just for reference; it doesn’t represent the actual module encapsulation)
In addition, do not lay out other components within 2mm around the module’s position on main board
to ensure the maintenance of the module.
The white
oil need be
removed