Zodiac EXT, Руководство пользователя, Страница: 13 / 30

Potting procedure
MUT300082E1R1 — 02 – 2017 9
INST
ALL
A
TION
5. If waterproofness is required for your electronics, consider using filling material.
Refer to
⇨
Potting procedure – page 9 for more details.
3.2.3 Filling material
The user area of the PRO and EXT modules are not filled to allow user operation. Precautions must be taken if
waterproofness of the user area is a requirement for the application.
Refer to
⇨
Potting procedure – page 9 for more details.
3.3 Potting procedure
This procedure is a recommendation from ZODIAC DATA SYSTEMS for potting the
customer area
of:
■
The PRO module when used alone
■
The PRO+EXT modules when used together (for higher component clearance, or double connector capacity)
3.3.1 Precautions
Wear appropriate ESD protection (wrist band and gowns) and gloves (for chemicals preparation and handling)
After boards are cleaned, always wear gloves to manipulate the module.
This procedure requires specific tools to be manufactured.
Check chemicals validity date.
Please comply to the steps order hereafter.
3.3.2 Mezzanine board preparation
1. The MicroComp external connector should be wired and soldered. It is highly recommended to place all 51
contacts in the connector (or both connectors for PRO+EXT).
a) Use the appropriate tool and procedure to insert contacts
Note:
◆
The DAU stack waterproofness is ensured by the filling material at the DAU internal connector area.
◆
Power lands are protected and short circuits transients on these lands will not affect DAU operation.