Yaesu FRG-100, Техническое дополнение

Страница: 5 / 79

Chip Component Information
Chip Components
Chip components are installed at the
by a series of robots. The first one
a small spot of adhesive at the location
where part is to be installed, and later
robots handle and using vacuum
suction.
For sided boards, is
plied and the board is then baked to harden
the and flow the For double sided
boards, no is applied, but the
board is baked (or exposed to ultra-violet
light) to the before dip soldering.
In our laboratories and Service shops, small
quantities of components are mounted
manually by applying a spot of placing
with tweezers, and then soldering by very
small dual streams of hot air (without
cal contact soldering). We remove
by first removing using a vacuum
suction iron, applies a light steady
uum at the iron tip, and then breaking the
adhesive with tweezers.
T h e
ment is recommended if you expect to do a lot
of Otherwise, it is usually
possible to remove and replace
nents with only a tapered,
trolled soldering iron, a set of tweezers and
braided Soldering iron
temperature should be below 280” C
Chip
D
O
not disconnect a or the
foil Pattern may peel off the board.
Never re-use a component. Dispose of
all removed components immediately to
avoid mixing with new
Limit soldering time to 3 seconds or less to
avoid damaging the component and board.
Removing Chip Components
Remove the at joint, one joint at a
time, using whetted with
acidic fluxes as shown below. Avoid applying
pressure, and do not attempt to remove
ning the
Grasp the on both sides with tweezers,
and gently twist the tweezers back and forth
(to break the adhesive bond) while
nately heating
Be careful to
avoid peeling the foil from the board.
Dispose of the when removed.
After removing the use the braid
and soldering iron to away any excess
and smooth the land for installation of
the part.
00 Supplement