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Spartan-3A DSP FPGA Family: Pinout Descriptions
DS610 (v3.0) October 4, 2010
www.xilinx.com
Product Specification
64
Electronic versions of the package pinout tables and foot- prints are available for download from the Xilinx® website. Using
a spreadsheet program, the data can be sorted and reformatted according to any specific needs. Similarly, the ASCII-text file
is easily parsed by most scripting programs.
www.xilinx.com/support/documentation/data_sheets/s3a_pin.zip
Package Overview
Table 60
shows the two low-cost, space-saving production package styles for the Spartan-3A DSP family.
Each package style is available as a standard and an environmentally friendly lead-free (Pb-free) option. The Pb-free
packages include an extra ‘G’ in the package style name. For example, the standard “CS484” package becomes “CSG484”
when ordered as the Pb-free option. The mechanical dimensions of the standard and Pb-free packages are similar, as
shown in the mechanical drawings provided in
Table 61
.
For additional package information, see
UG112
:
Device Package User Guide
.
Mechanical Drawings
Detailed mechanical drawings for each package type are available from the Xilinx web site at the specified location in
Table 61
.
Material Declaration Data Sheets (MDDS) are also available on the
Xilinx web site
for each package.
Table 60:
Spartan-3A DSP Family Package Options
Package
Leads
Type
Maximum
I/O
Lead Pitch
(mm)
Footprint
Area (mm)
Height
(mm)
Mass
(1)
(g)
CS484 / CSG484
484
Chip-Scale Ball Grid Array (CS)
309
0.8
19 x 19
1.80
1.4
FG676 / FGG676
676
Fine-pitch Ball Grid Array (FBGA)
519
1.0
27 x 27
2.60
3.4
Notes:
1.
Package mass is
±
10%.
Table 61:
Xilinx Package Documentation
Package
Drawing
MDDS
CS484
Package Drawing
PK230_CS484
CSG484
PK231_CSG484
FG676
Package Drawing
PK155_FG676
FGG676
PK111_FGG676