TSSP57P38
www.vishay.com
Vishay Semiconductors
Rev. 2.2, 30-Mar-2021
6
Document Number: 82480
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
PACKAGE DIMENSIONS
in millimeters
ASSEMBLY INSTRUCTIONS
Reflow Soldering
• Reflow soldering must be done within 168 h while stored
under a max. temperature of 30 °C, 60 % RH after
opening the dry pack envelope
• Set the furnace temperatures for pre-heating and heating
in accordance with the reflow temperature profile as
shown in the diagram. Exercise extreme care to keep the
maximum temperature below 260 °C. The temperature
shown in the profile means the temperature at the device
surface. Since there is a temperature difference between
the component and the circuit board, it should be verified
that the temperature of the device is accurately being
measured
• Handling after reflow should be done only after the work
surface has been cooled off
Manual Soldering
• Use a soldering iron of 25 W or less. Adjust the
temperature of the soldering iron below 300 °C
• Finish soldering within 3 s
• Handle products only after the temperature has cooled off
Notes
(1)
Optically effective area
(2)
Pins connected internally. It is not necessary to connect externally
Drawing-No.: 6.550-5315.01-4
Issue: 2; 12.02.14
Not indicated tolerances ± 0.1
technical drawings
according to DIN
specifications
Proposed pad layout from
component side
(dim. for reference only)
(3.95)
(3.95)
(0.35)
(0.8)
(2.75)
(3)
(4 x)
(4x)
0.55
(0.95)
0.55
(1.8)
0.75
± 0.05
4 x 0.75 = 3
0.35
± 0.05
(8 x)
1.5
3
(0.3)
(0.3)
(0.3)
(0.7)
0.475
(0.4)
0.8
0.15
Pinning from topview
GND
GN
D
Out
Vs
(V
s
)
(G
N
D
)
(G
N
D
)
(G
N
D
)
1 2 3 4 5
8 7 6
Pin 1 identification
(2)
(2)
(2)
(2)
3.95
3.95
(2.75)
(1.9)
(3.4)
marking area
Pin 1 Identification
(1)
(1)
(1)
