![background image](http://html1.mh-extra.com/html/viewsonic/vx2476-sh/vx2476-sh_user-manual_1019940038.webp)
34
5. Copper alloy containing up to 4% lead by weight.
6. Lead in high melting temperature type solders (i.e. lead-based
alloys containing 85% by weight or more lead).
7. Electrical and electronic components containing lead in a glass
or ceramic other than dielectric ceramic in capacitors, e.g. piezo-
electronic devices, or in a glass or ceramic matrix compound.