Design Guide & Applications Manual
Maxi, Mini, Micro Family DC-DC Converters and Configurable Power Supplies
Maxi, Mini, Micro Design Guide
Rev 5.0
Page 4 of 87
03/2018
1. High-Density DC-DC Converter Technology
Key to the design of Maxi, Mini, Micro converters is its high level
of component-level integration. (Figure 1.2) With the aid of hybrid
technology, the device packs all control functions and active
circuitry into two (primary and secondary side) ICs occupying a total
volume of less than 1/10in
3
[1,6cm
3
] each.
With Maxi, Mini, Micro devices, the plated-cavity transformer
cores use copper armor, plated onto the ferrite core, to more
closely confine the magnetic flux to couple widely separated
primary and secondary windings. The wider separation provides
greater isolation and therefore lowers input-to-output parasitic
capacitance and noise. The plated cavity also serves to conduct
heat away from the transformer to the baseplate, thus increasing
the power-handling capability of the powertrain and minimizing
temperature rise.
The powertrain assembly is contained between the baseplate and a
terminal-block assembly, with input and output pins recessed. This
allows the converter body to be mounted into an aperture in the
PCB to reduce the height above board. The modules may be wave
soldered or plugged into through-hole or surface-mount sockets.
The Maxi, Mini, Micro devices use a proprietary, low-noise,
integrated power device that has an order of magnitude lower
parasitic effect.
The advances made in the overall design of the Maxi, Mini, Micro
Family DC-DC converters have been complemented by equally
significant advances in the technology used to manufacture
them. Vicor invested in a custom, fully-automated assembly
line specifically designed for the assembly of Maxi, Mini, Micro
power components. To further augment its Maxi, Mini, Micro
product offering, Vicor has created an online user-interface tool,
, that allows customers to specify DC-DC module
requirements anytime, anywhere via the internet.
Bottom View
• Standard MLP power devices
• Efficient pick-and-place assembly
Top View
• Surface-mount components for greater
manufacturing efficiency
• Standard reflow process
Baseplate
• Simplified baseplate construction
Complete Assembly
• Insert molded terminal block for more
accurate pin positioning
• One-piece cover with label
• Encapsulated for superior thermal performance
Figure 1.2 —
Maxi assembly shows high level of integration
Model Number
Serial No. & Date Code
