Vescent ICE, Руководство по интеграции OEM

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Last update: 2014/07/30 18:37 ice:oem_integration http://www.vescent.com/manuals/doku.php?id=ice:oem_integration
http://www.vescent.com/manuals/ Printed on 2019/05/01 00:16
Fig. 4: ICE circuit boards in a stacked configuration
An alternative style of mounting is to attach each circuit board side by side in the same plane. In this
case, no boards would be stacked on top of one another and a custom designed circuit board would
have to be used as backplane. This backplane circuit board would distribute power and
communications between the boards using the same 0.1 inch headers (see
PCB Mechanical
Specifications page for part numbers) used on each ICE board.
Thermal Management
Please see PCB Mechanical Specifications page for more
details and technical drawings.
Each PCB exposes up to 4 copper tabs to conduct heat out from power dissipating components to an
external heat sink. The copper tabs are not electrically isolated, so electrical isolation is required at
the interface between the heatsink and copper tab. Failure to isolate these tabs will result in
malfunction of the ICE module. For electrical isolation with good thermal conductivity,
Sil-Pad can be
used. Sil-Pad requires a certain amount of pressure to ensure good thermal conductivity, so a clamp
mechanism should be applied to the copper tabs. The Sil-Pad is shown in pink in
figure 5 and figure 6 .
Further information on thermal management of the ICE boards, including CAD drawings of the heat
sink clamp assembly, can be
downloaded here .
Each copper heat sink tab must be electrically isolated from
the heatsink and one another.