VersaLogic VL-EPU-4460, Справочник по аппаратуре

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Thermal Considerations
56 VL-EPU-4460 Reference Manual
Heat Sink with Fan Considerations:

The heat sink and fan combination cools the CPU when it is running in high temperature
environments, or when the application software is heavily utilizing the CPU or video
circuitry. The fan assists in cooling the heat sink and provides additional air movement
within the system.

Integrator’s Note: The ambient air surrounding the EPU-4460 needs to be maintained
at 85 °C or below.
EPU-4460 Thermal Characterization
The EPU-4460 board underwent the following thermal characterization tests:

Test Scenario 1: Dual core EPU-4460-EAP (Active and passive)

Test Scenario 2: Dual core EPU-4460-EBP (Active and passive)

Test Scenario 3: Dual core EPU-4460-ECP (Active and passive)
This table describes the thermal testing setup for the board.
Table 20. EPU-4460 Thermal Testing Setup
Hardware
Configuration
EPU-4460 (Condor) dual core CPU with:

32 GB of DDR4 DRAM (2 GB for the single- and dual-core board models)

HDW-416 (passive heat sink)

HDW-415 (heat sink fan)

One VGA display device (connected through the LVDS interface), one
display for monitor

One SATA hard disk drive

Two RS-232 ports in loopback configuration

Two VersaLogic VL-MPEe-E3 Mini PCIe Gigabit Ethernet modules

Two active Ethernet ports in loopback configuration

Two USB 2.0 ports in loopback configuration (Note)

USB keyboard and mouse (Note)
BIOS

VER2C101

Passive thermal trip point setting: 105 ºC

Critical thermal trip point setting: 111 ºC
Operating System

Microsoft Windows 10 Enterprise
Test Software

Passmark BurnIn Test v8.1 b1018
- CPU utilization ~90%

Intel Thermal Analysis Tool (TAT) v5.0.1026
- Primarily used to read the CPU core temperature
Test Environment

Thermal chamber
Note: This device connects through a VersaLogic VL-CBR-4005B paddleboard.
The test results reflect the test environment within the temperature chamber used. The airflow of
this particular chamber is about 0.5 linear meters per second (~100 linear feet per minute).
Thermal performance improves by increasing the airflow beyond 0.5 linear meters per second.