VersaLogic Viper VL-EBX-38EBP, Справочник по аппаратуре

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Thermal Considerations
EBX-38 Hardware Reference Manual
64
EBX-38 Thermal Characterization
The EBX-38 board underwent the following thermal characterization tests:

Test Scenario 1: Single core EBX-38EAP with passive and active thermal solutions

Test Scenario 2: Dual core EBX-38EBP with passive and active thermal solutions

Test Scenario 3: Quad core EBX-38ECP with passive and active thermal solutions

The table below describes the thermal testing setup for the board.
Table 34. EBX-38 Thermal Testing Setup
Hardware Configuration
EBX-38 (Viper) core CPU with:

8 GB of DDR3 DRAM (VersaLogic part number VL-MM9-4EBN)

HDW-406 (passive heat sink)

HDW-407 (heat sink fan)

One attached DisplayPort device

Two RS-232 ports in loopback configuration

Two active Ethernet ports

Three USB 2.0 ports in loopback configuration
BIOS

IP-1081

Passive thermal trip point setting: 105 ºC

Critical thermal trip point setting: 110 ºC
Operating System 
Microsoft Windows* 10 Enterprise
Test Software

Passmark* BurnIn Test v8.1
- CPU utilization ~90%

Intel Thermal Analysis Tool* (TAT) v6.0.1007
- Primarily used to read the CPU core temperature
Test Environment 
Thermal chamber
The test results reflect the test environment within the temperature chamber used. This particular
chamber has an airflow of about 0.5 meters per second (~100 linear feet per minute). Thermal
performance can be greatly enhanced by increasing the overall airflow beyond 0.5 meters per
second.
The system power dissipation is primarily dependent on the application program - that is, its use
of computing or I/O resources. The stress levels used in this testing are considered to be at the
top of the range of a typical user’s needs.