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UC-00-M33 EN R1.0 

Packaging 

19 

Cooling Stage 

 

Cooling slope: Max. 4 °C / s   

 

 

In order to prevent falling off during soldering of the module, do not solder it on the 

back of the board during design, and it is not recommended to go through 

soldering cycle twice. 

 

The setting of soldering temperature depends on many factors of the factory, such 

as board type, solder paste type, solder paste thickness etc. Please also refer to the 

relevant IPC standards and indicators of solder paste. 

 

Since the lead soldering temperature is relatively low, if using this method, please 

give priority to other components on the board. 

 

The opening of the stencil needs to meet your design requirement and comply with 

the examine standards. The thickness of the stencil is recommended to be 0.15 

mm. 

 

5

 

Packaging 

5.1

 

Label Description 

 

Figure 5-1 Label Description 

 

5.2

 

Product Packaging 

The UM981 module uses carrier tape and reel (suitable for mainstream surface mount 

devices), packaged in vacuum-sealed aluminum foil antistatic bags, with a desiccant 

inside to prevent moisture. When using reflow soldering process to solder modules, 

please strictly comply with IPC standard to conduct temperature and humidity control 

on the modules. As packaging materials such as the carrier tape can only withstand the 

Product Model

 

Part Number

 

Serial Number

 

Product QR Code

 

Содержание UM981

Страница 1: ...N USER MANUAL WWW UNICORECOMM COM Copyright 2009 2023 Unicore Communications Inc Data subject to change without notice UM981 BDS GPS GLONASS Galileo QZSS All constellation Multi frequency RTK INS Inte...

Страница 2: ...serial referred to in this manual collectively Unicore Trademarks This manual or any part of it shall not be deemed as either expressly implied by estoppel or any other form the granting or transferr...

Страница 3: ...Manual ii Should you purchase our product and encounter any inconsistency please contact us or our local authorized distributor for the most up to date version of this manual along with any addenda or...

Страница 4: ...eword This document describes the hardware information specifications packaging and the use of Unicore UM981 modules Target Readers This document is written for technicians who are familiar with GNSS...

Страница 5: ...aximum Ratings 10 2 2 2 Operating Conditions 11 2 2 3 IO Threshold 11 2 2 4 Antenna Feature 12 2 3 Dimensions 12 3 Hardware Design 14 3 1 Recommended Minimal Design 14 3 2 Antenna Feed Design 15 3 3 P...

Страница 6: ...ocessed with 22 nm low power design and supports 1408 channels being able to output 100 Hz IMU raw data and up to 50 Hz RTK positioning result providing powerful data processing ability With the built...

Страница 7: ...lti frequency RTK engine and advanced RTK processing technology Instantaneous RTK initialization technology Independent tracking of different frequencies and 60 dB narrowband anti jamming technology 1...

Страница 8: ...B1C L1C L1 C A G1 E1 Pseudorange 10 cm 10 cm 10 cm 10 cm B1I B1C L1C L1 C A G1 E1 Carrier Phase 1 mm 1 mm 1 mm 1 mm B3I L2P Y L2C G2 E6 Pseudorange 10 cm 10 cm 10 cm 10 cm B3I L2P Y L2C G2 E6 Carrier...

Страница 9: ...tput 50 Hz RTK positioning result output Differential Data RTCM 3 X Data Format NMEA 0183 Unicore Physical Characteristics Package 54 pin LGA Dimensions 22 mm 17 mm 2 6 mm Weight 1 91 g 0 03 g Environ...

Страница 10: ...ERR EVENT PPS Figure 1 2 UM981 Block Diagram RF Part The receiver gets filtered and enhanced GNSS signal from the antenna via a coaxial cable The RF part converts the RF input signals into the IF sig...

Страница 11: ...S EVENT RTK_STAT PVT_STAT ERR_STAT RESET_N etc 2 Hardware 2 1 Pin Definition 1 2 3 4 5 6 7 8 9 10 11 12 13 14 42 43 44 45 46 47 48 49 50 51 52 53 54 27 26 25 24 23 22 21 20 19 18 17 16 15 41 40 39 38...

Страница 12: ...pply 8 SPIS_CSN I Chip select pin for SPI slave 9 SPIS_MOSI I Master Out Slave In This pin is used to receive data in slave mode 10 SPIS_CLK I Clock input pin for SPI slave 11 SPIS_MISO O Master In Sl...

Страница 13: ...loating 23 RSV Reserved recommended to be floating 24 NC No connection inside 25 NC No connection inside 26 RXD2 I COM2 input LVTTL 27 TXD2 O COM2 output LVTTL 28 BIF Built in function recommended to...

Страница 14: ...If you do not use the hot start function connect V_BCKP to VCC Do NOT connect it to ground or leave it floating 37 GND Ground 38 NC No connection inside 39 NC No connection inside 40 NC No connection...

Страница 15: ...larity 54 NC No connection inside 2 2 Electrical Specifications 2 2 1 Absolute Maximum Ratings Table 2 2 Absolute Maximum Ratings Parameter Symbol Min Max Unit Power Supply Voltage VCC 0 3 3 6 V Input...

Страница 16: ...3 IO Threshold Table 2 4 IO Threshold Parameter Symbol Min Typ Max Unit Condition Low Level Input Voltage Vin_low 0 0 6 V High Level Input Voltage Vin_high VCC 0 7 VCC 0 2 V Low Level Output Voltage V...

Страница 17: ...imum Input Gain Gant 18 30 36 dB 2 3 Dimensions Table 2 6 Dimensions Parameter Min mm Typ mm Max mm A 21 80 22 00 22 50 B 16 80 17 00 17 50 C 2 40 2 60 2 80 D 3 75 3 85 3 95 E 0 95 1 05 1 15 F 1 80 1...

Страница 18: ...UC 00 M33 EN R1 0 Hardware 13 Figure 2 2 UM981 Mechanical Dimensions...

Страница 19: ...C2 C3 BIF BIF 3 3V R1 R1 TXD UART RXD UART IO Figure 3 1 Recommended Minimal Design L1 68 nH RF inductor in 0603 package is recommended C1 100 nF 100 pF capacitors connected in parallel is recommended...

Страница 20: ...feed supply ANT_BIAS and the module s main supply VCC use the same power rail the ESD surge and overvoltage from the antenna will have an effect on VCC which may cause damage to the module Therefore i...

Страница 21: ...uld be less than 0 4 V The VCC ramp when power on should be monotonic without plateaus The voltages of undershoot and ringing should be within 5 VCC VCC power on waveform The time interval from 10 ris...

Страница 22: ...cted to a large size ground to strengthen the heat dissipation 3 5 Recommended PCB Package Design See the following figure for the recommended PCB package design 1 79 1 79 2 29 1 09 3 58 3 25 1 90 17...

Страница 23: ...nterference on the RF signals 4 Production Requirement Recommended soldering temperature curve is as follows C 250 217 200 150 100 50 0 Rising Cooling Reflux Peak 245 C 40 60s 60 120s Preheating Max 4...

Страница 24: ...riority to other components on the board The opening of the stencil needs to meet your design requirement and comply with the examine standards The thickness of the stencil is recommended to be 0 15 m...

Страница 25: ...1 The cumulative tolerance of 10 side holes should not exceed 0 2 mm 2 Material of the tape Black antistatic PS surface impedance 105 1011 surface static voltage 100 V thickness 0 35 mm 3 Total lengt...

Страница 26: ...0 circle on the HUMIDITY INDICATOR is blue see Figure 5 4 If the color of the 20 circle is pink and the color of the 30 circle is lavender see Figure 5 5 you must bake the module until it turns to blu...

Страница 27: ...Unicore Communications Inc 7 F3 No 7 Fengxian East Road Haidian Beijing P R China 100094 www unicorecomm com Phone 86 10 69939800 Fax 86 10 69939888 info unicorecomm com www unicorecomm com...

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