
UM960eb & UM960Leb User Manual
UC-08-M34 EN R1.0
UM960 Series Peripheral Design
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Silkscreen markings are printed around the module to identify the resistors, which is
convenient for measurement.
Figure 6-2 UM960 Peripheral Circuit
The GND pads at the bottom of the module should be grounded to ensure heat
dissipation. The evaluation board has copper exposed on the bottom of the module,
which not only enhances heat dissipation, but also provides a large area for grounding
and is convenient to test.
U1B
UM960
Figure 6-3 Pads (Y1-Y55) and Socket Mounting Holes (X1-X8)