NINA-B2 series - System Integration Manual
UBX-18011096 - R03
Contents
Page 21 of 30
4
Handling and soldering
No natural rubbers, hygroscopic materials or materials containing asbestos are employed.
4.1
Packaging, shipping, storage and moisture preconditioning
For information pertaining to reels, tapes or trays, moisture sensitivity levels (MSL), shipment and
storage, as well as drying for preconditioning refer to NINA-B2 series Data Sheet [2] and u-blox
Package Information Guide [3].
4.2
Handling
The NINA-B2 series modules are Electro-Static Discharge (ESD) sensitive devices and require
special precautions during handling. Particular care must be exercised when handling patch
antennas, due to the risk of electrostatic charges. In addition to standard ESD safety practices, the
following measures should be taken into account whenever handling the receiver:
•
Unless there is a galvanic coupling
between the local GND (i.e. the work table)
and the PCB GND, then the first point of
contact when handling the PCB must
always be between the local GND and PCB
GND.
•
Before mounting an antenna patch,
connect ground of the device
•
When handling the RF pin, do not come
into contact with any charged capacitors
and be careful when contacting materials
that can develop charges (e.g. patch
antenna ~10 pF, coax cable ~50-80 pF/m,
soldering iron, …)
•
To prevent electrostatic discharge through
the RF input, do not touch any exposed
antenna area. If there is any risk that such
exposed antenna area is touched in non
ESD protected work area, implement
proper ESD protection measures in the
design.
•
When soldering RF connectors and patch
antennas to the receiver’s RF pin, make
sure to use an ESD safe soldering iron (tip).
4.3
Soldering
4.3.1
Reflow soldering process
The NINA-B2 series modules are surface mount modules supplied on a FR4-type PCB with gold
plated connection pads and are produced in a lead-free process with a lead-free soldering paste. The
bow and twist of the PCB is maximum 0.75% according to IPC-A-610E. The thickness of solder
resist between the host PCB top side and the bottom side of the NINA-B2 series module must be
considered for the soldering process.
