Ublox LENA-R8 Series, Руководство по системной интеграции

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LENA-R8 series - System integration manual
UBX-22015376 - R02 Design-in Page 92 of 116
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2.14 Module footprint and paste mask
Figure 73 and Table 51 describe the suggested footprint (i.e. copper mask) and paste mask layout for
LENA modules: the proposed land pattern layout reflects the modules’ pins layout, while the proposed
stencil apertures layout is slightly different (see the F’’, H’’, I’’, J’’, O’’ parameters compared to the F’,
H’, I’, J’, O’ ones).
The Non Solder resist Mask Defined (NSMD) pad type is recommended over the Solder resist Mask
Defined (SMD) pad type, implementing the solder mask opening 50
µ
m larger per side than the
corresponding copper pad.
The recommended solder paste thickness is 150
µ
m, according to application production process
requirements.
Foot-print
Top View
K
M1
M1
M2
E
H’ J’
E
B
K
G
H’
J’
D
A
D
O’
O’
L
N
L
I’
F1’
F2’
G
H’
G G ANT
Pin 1
J’
Paste-mask
Top View
K
M1
M1
M2
E
H’’ J’’
E
B
K
G
H’’
J’’
D
A
D
O’’
O’’
L
N
L
I’’
F1’’
F2’’
G
H’’
G G ANT
Pin 1
J’’
Figure 73: LENA-R8 series modules suggested footprint and paste mask (application board top view)
Parameter Value Parameter Value Parameter Value
A 30.0 mm G 1.10 mm K 4.75 mm
B 27.0 mm H’ 0.80 mm L 8.25 mm
D 4.00 mm H’’ 0.75 mm M1 1.80 mm
E 8.00 mm I’ 1.50 mm M2 3.60 mm
F1’ 3.05 mm I’’ 1.55 mm N 2.10 mm
F1’’ 3.00 mm J’ 0.30 mm O’ 1.10 mm
F2’ 6.65 mm J’’ 0.35 mm O’’ 1.05 mm
F2’’ 6.50 mm
Table 51: LENA-R8 series modules suggested footprint and paste mask dimensions
☞
These are recommendations only and not specifications. The exact copper, solder and paste mask
geometries, distances, stencil thicknesses and solder paste volumes must be adapted to the
specific production processes (e.g. soldering etc.) of the customer.