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LEA-M8F - Hardware Integration Manual 

 

UBX-14000034 - R03 

Early Production

 Information

 

Hardware

 description

 

 

 

Page 7 of 30

 

 

1.3

 

Pin description for LEA-M8F designs 

 

 

 

Function 

PIN 

No 

I/O  Description 

Remarks 

Power 

VCC

 

Supply Voltage 

Provide a clean and stable supply. 

GND

 

7, 
13-
15, 
17 

Ground 

Assure a low impedance 

GND

 connection to all 

GND

 pins of 

the module, preferably with a large ground. 

V_BCKP

 

11 

 

connect to 

VCC

. (Back-up mode not supported) 

VDDUSB

 

24 

USB Power Supply 

To use the USB interface connect this pin to 3.0 – 3.6 V 
derived from VBUS. 

 

If no USB serial port used connect to GND. 

Antenna 

RF_INPUT

 

16 

GPS/GLONASS/ 
BeiDou/signal input 
from antenna 

Use a controlled impedance transmission line of 50 

 to 

connect to RF_IN. 
Don’t supply DC through this pin. Use 

V_ANT

 pin to supply 

power. 

VCC_RF

 

18 

Output Voltage RF 
section 

Can be used to power an external active antenna 

). The max 

power consumption of the Antenna must not exceed the 
datasheet specification of the module. 
Leave open if not used. 

V_ANT

 

19 

Antenna Bias voltage  Connect to 

GND

 (or leave open) if Passive Antenna is used. If 

an active Antenna is used, add a 10 

 resistor in front of 

V_ANT

 input to the Antenna Bias Voltage or 

VCC_RF

 

Reserved

 

20 

 

Leave open 

UART  

TxD1/MISO/       
TX ready

 

Serial Port 1 or SPI 
Data i/p 

 Communication interface o/p function dependent on D_SEL. It 
can also can be programmed as TX ready for DDC interface. 
Leave open if not used.  

RxD1/MOSI

 

Serial Port 1 or SPI 
Data o/p 

Communication interface i/p dependent on D_SEL with 
internal pull-up resistor to VCC. Leave open if not used. Don’t 
use external pull up resistor. 

USB 

USB_DM

 

25 

I/O 

USB I/O line 

USB2.0 bidirectional communication pin. Leave open if 
unused. For example implementations see

 

section 1.5.2 

USB_DP

 

26 

I/O 

USB I/O line 

System 

RESET_N

 

10 

Hardware Reset 
(Active Low) 

Leave open if not used. 

TIMEPULSE/TP2/ 
SAFEBOOT_N

 

28 

I/O 

Timepulse Signal 

Configurable Timepulse signal (one pulse per second by 
default). Leave open if not used.  

FREQ_PHASE_IN0/
EXTINT0

 

27 

TimePulse/Frequency 

General purpose frequency/phase measurement input 0, 
Alternate function: External Interrupt 0 

FREQ_PHASE_IN1/
EXTINT1 

21 

TimePulse/Frequency 

General purpose frequency/phase measurement input 1 
Alternate function: External Interrupt 1 

REF_FREQ_OUT 

VCTCXO o/p 

Buffered output from the disciplined internal 30.72MHz 
VCTCXO 

SDA 

/CS_N

 

I/O 

DDC Data Pin 
or SPI chip sel. 

DDC Data. Leave open if not used. 
or SPI chip select: dependent on DSEL 

SCL 
/SCLK

 

I/O 

DDC Clk Pin 
or SPI clk 

DDC Clock. Leave open if not used.

  

or SPI clock: dependent on DSEL 

SAFEBOOT_N

 

12 

 

Test-point for service access. Leave open, do not drive low. 

D_SEL

 

 

Selects the 
interface protocol 

Used to select UART+DDC or SPI 
Open = UART+DDC; low = SPI on pins 1,2,3,4 

SDA_DAC 

22 

I/O 

DDC Data pin 

For DAC control of external Freq Reference Only 

SCL_DAC

 

23 

DDC Clk pin 

For DAC control of external Freq Reference Only 

Table 1: LEA-M8F Pinout  

 
 

Содержание LEA-M8F

Страница 1: ...rence module This device incorporates the u blox M8 concurrent GNSS IC that can receive GPS GLONASS BeiDou and QZSS signals It provides a low phase noise 30 72MHz system reference oscillator disciplin...

Страница 2: ...ucts Product name Type number ROM FLASH version PCN reference LEA M8F LEA M8F 0 00 FLASH FW2 20 FTS1 01 N A u blox reserves all rights to this document and the information contained herein Products na...

Страница 3: ...10 1 6 1 RESET_N 10 1 6 2 D_SEL 10 1 6 3 FREQ_PHASE_IN0 EXINT0 FREQ_PHASE_IN1 EXTINT1 11 1 6 4 REF_FREQ_OUT 11 1 6 5 TIMEPULSE TP2 11 1 7 Device Configuration 11 2 Design 12 2 1 Layout Footprint and...

Страница 4: ...3 Early Production Information Contents Page 4 of 30 4 3 EOS ESD EMI precautions 23 4 4 Applications with cellular modules 26 Appendix 28 Recommended parts 28 Manufacturer 28 Order No 28 Comments 28 R...

Страница 5: ...d providing 100 ppb autonomous hold over An external TCXO or OCXO can also be measured and controlled for TD LTE LTE Advanced and other applications requiring extended hold over External sources of sy...

Страница 6: ...schematic view of the module s internal organization Figure 1 LEA M8F Block Diagram The device contains all the elements required to implement a multi GNSS frequency and time synchronization system It...

Страница 7: ...med as TX ready for DDC interface Leave open if not used RxD1 MOSI 4 I Serial Port 1 or SPI Data o p Communication interface i p dependent on D_SEL with internal pull up resistor to VCC Leave open if...

Страница 8: ...Receiver Transmitter UART serial interface RxD TxD supporting configurable baud rates See the LEA M8F Data Sheet 1 for the supported baud rates The signal input and output levels are 0 V to VCC with...

Страница 9: ...ent 1 mA if the GNSS receiver is operated as a USB self powered device C23 C24 Capacitors Required according to the specification of LDO U1 D2 Protection diodes Protect circuit from overvoltage ESD wh...

Страница 10: ...er combination connected to a VCTCXO VCOCXO Note that 12 bit DAC may not provide sufficient resolution if used over the full circuit voltage range and hence may compromise the controlled frequency per...

Страница 11: ...the module s disciplined 30 72MHz VCTCXO CMOS buffer via on module resistor 1 6 5 TIMEPULSE TP2 The timepulse signal is output from this pin This pin is the standard u blox M8 TP2 output hence all tim...

Страница 12: ...ldering of the customer 17 0 mm 669 mil 22 4 mm 881 9 mil 1 0 mm 39 mil 0 8 mm 31 5 mil 2 45 mm 96 5 mil 1 1 mm 43 mil 3 0 mm 118 mil 2 15 mm 84 5 mil 0 8 mm 31 5 mil Stencil 150 m 15 7 mm 618 mil 17...

Страница 13: ...eet 1 2 1 2 Antenna connection and ground plane design The LEA M8F module can be connected to passive patch or active antennas The RF connection is on the PCB and connects the RF_IN pin with the anten...

Страница 14: ...or fill with ground planes H H Figure 8 PCB build up for micro strip line Left 2 layer PCB right 4 layer PCB General design recommendations The length of the micro strip line should be kept as short...

Страница 15: ...tion for printed circuit boards The basic configuration is shown in Figure 10 and Figure 11 As a rule of thumb for an FR 4 material the width of the conductor is roughly double the thickness of the di...

Страница 16: ...onents therefore take care to reduce electrical noise that may interfere with the antenna performance Passive antennas do not require a DC bias voltage and can be directly connected to the RF input pi...

Страница 17: ...ltage at VCC_RF to supply the antenna DC power The V_ANT pin provides a current limited supply connection to the RF_IN pin for antenna LNA biasing see Figure 13 below Figure 13 Active antenna design e...

Страница 18: ...he u blox support team to ensure the compatibility of key functionalities 3 1 Software migration For an overall description of the module software operation see the u blox M8 Receiver Description incl...

Страница 19: ...ply V_BCKP Backup voltage supply Back up operation not supported Connect to Vcc 12 SAFEBOOT_ N GND Reserved Leave Open Test point for service access 13 GND GND GND GND No difference 14 GND GND GND GND...

Страница 20: ...s on the connectors half vias should meet the appropriate IPC specification Reflow soldering A convection type soldering oven is highly recommended over the infrared type radiation oven Convection hea...

Страница 21: ...oldering the u blox M8 module consider an optical inspection step to check whether The module is properly aligned and centered over the pads All pads are properly soldered No excess solder has created...

Страница 22: ...th a cross diagonal fixture soldering e g pins 1 and 15 and then continue from left to right Rework The u blox M8 module can be unsoldered from the baseboard using a hot air gun When using a hot air g...

Страница 23: ...rve strict EOS ESD EMI handling and protection measures To prevent overstress damage at the RF_IN of your receiver never exceed the maximum input power see LEA M8F Data Sheet 0 Electrostatic discharge...

Страница 24: ...tection measures Using an LNA with appropriate ESD rating can provide enhanced GNSS performance with passive antennas and increases ESD protection Most defects caused by ESD can be prevented by follow...

Страница 25: ...SD rating Figure 17 EOS and ESD Precautions Electromagnetic interference EMI Electromagnetic interference EMI is the addition or coupling of energy originating from any RF emitting device This can cau...

Страница 26: ...chieved e g in the case of an integrated GSM GNSS antenna an additional input filter is needed on the GNSS side to block the high energy emitted by the GSM transmitter Examples of these kinds of filte...

Страница 27: ...at are different from the GNSS carrier see Figure 21 The main sources are wireless communication systems such as GSM CDMA WCDMA Wi Fi BT etc 0 500 1000 1500 2000 GPS input filter characteristics 0 110...

Страница 28: ...TA1343A GPS GLONASS BeiDou Low insertion loss TAI SAW TA0638A GPS GLONASS BeiDou Low insertion loss LNA JRC NJG1143UA2 LNA Low noise figure up to 15 dBm RF input power DAC TI DAC8571 Osc Control Volt...

Страница 29: ...tion Version 2 1 Jan 2000 http www nxp com acrobat_download literature 9398 39340011_21 pdf 9 GPS Implementation and Aiding Features in u blox wireless modules Docu No GSM G1 CS 09007 For regular upda...

Страница 30: ..._ap u blox com Support support_ap u blox com Regional Office Australia Phone 61 2 8448 2016 E mail info_anz u blox com Support support_ap u blox com Regional Office China Beijing Phone 86 10 68 133 54...

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