NORA-W30 series - System integration manual
UBX-22021119 - R02
Design-in
Page 27 of 52
C1-Public
shows the pin layout of NORA-W30 series modules. The proposed land pattern layout
complements the pin layout of the module. Both Solder Mask Defined (SMD) and Non-Solder Mask
Defined (NSMD) pins can be used with adherence to the following considerations:
•
All pins should be Non-Solder Mask Defined (NSMD)
•
To help with the dissipation of the heat generated by the module, GND pads must have good
thermal bonding to PCB ground planes.
The suggested stencil layout for the NORA-W30 module should follow the copper pad layout, as
shown in
. The assembly house should determine the thickness of the solder paste stencil
based on the entire host PCB, typically 100-120
μ
m.
3.6
Thermal guidelines
The NORA-W30 series modules have been successfully tested in -40 °C to +105 °C. A good grounding
should be observed for temperature relief during high ambient temperature.
3.7
ESD guidelines
The immunity of devices integrating NORA-W30 modules to Electro-Static Discharge (ESD) is part of
the Electro-Magnetic Compatibility (EMC) conformity, which is required for products bearing the CE
marking, compliant with the R&TTE Directive (99/5/EC), the EMC Directive (89/336/EEC) and the Low
Voltage Directive (73/23/EEC) issued by the Commission of the European Community.
Compliance with these directives implies conformity to the following European Norms for device ESD
immunity: ESD testing standard
CENELEC EN 61000-4-2 and the radio equipment standards ETSI
EN 301 489-1, ETSI EN 301 489-7, ETSI EN 301 489-24, the requirements of which are summarized
The ESD immunity test is performed at the enclosure port, defined by
ETSI EN 301 489-1 as the
physical boundary through which the electromagnetic field radiates. If the device implements an
integral antenna, the enclosure port is seen as all insulating and conductive surfaces housing the
device. If the device implements a removable antenna, the antenna port can be separated from the
enclosure port. The antenna port includes the antenna element and its interconnecting cable
surfaces.
The applicability of ESD immunity test to the whole device depends on the device classification as
defined by
ETSI EN 301 489-1. Applicability of ESD immunity test to the related device ports or the
related interconnecting cables to auxiliary equipment, depends on the device accessible interfaces
and manufacturer requirements, as defined by the
ETSI EN 301 489-1.
Contact discharges are performed at conductive surfaces, while air discharges are performed at
insulating surfaces. Indirect contact discharges are performed on the measurement setup horizontal
and vertical coupling planes as defined in the
CENELEC EN 61000-4-2.
For the definition of integral antenna, removable antenna, antenna port, and device classification,
refer to the ETSI EN 301 489-1. For the contact and air discharges definitions, refer to CENELEC EN
61000-4-2.
Parameter
Min. Typical Max. Unit Remarks
ESD immunity. All exposed surfaces of the
radio equipment and ancillary equipment in a
representative configuration
8*
kV
Indirect discharge according to IEC 61000-4-2
ESD sensitivity, tested for all pins
2.0
kV
Human body model according to JEDEC
EIA/JESD22-A114
* Preliminarily tested on EVK-NINA-W30 evaluation board (EVK-NORA-W30 tests pending).
Table 10: Electro-Magnetic Compatibility ESD immunity requirements as defined by CENELEC EN 61000-4-2, ETSI EN 301
489-1, ETSI EN 301 489-7, ETSI EN 301 489-24
