LEON-G100 / LEON-G200 - System Integration Manual
GSM.G1-HW-09002-G3
Preliminary
Design-In
Page 90 of 125
2.2.2
Footprint and paste mask
Figure 47 and Figure 48 describe the footprint and provide recommendations for the paste mask for LEON
modules. These are recommendations only and not specifications. The copper and solder masks have the same
size and position.
29
.5
m
m
[
11
61
.4
m
il]
18.9 mm [744.1 mil]
0.8 mm [31.5 mil]
1.1 mm [43.3 mil]
1.55 mm [61.0 mil]
1.0 mm [39.3 mil]
0.8 mm [31.5 mil]
Figure 47: LEON-G100 / LEON-G200 footprint
21.3 mm [838.6 mil]
18.9 mm [744.1 mil]
Stencil: 120 µm
17.1 mm [673.2 mil]
0.
6
mm
[2
3.
6
m
il]
0.
8
m
m
[3
1.
5
m
il]
Figure 48: LEON-G100 / LEON-G200 paste mask
To improve the wetting of the half vias, reduce the amount of solder paste under the module and increase the
volume outside of the module by defining the dimensions of the paste mask to form a T-shape (or equivalent)
extending beyond the Copper mask. The solder paste should have a total thickness of 120 µm.
The paste mask outline needs to be considered when defining the minimal distance to the next
component.
The exact geometry, distances, stencil thicknesses and solder paste volumes must be adapted to the
specific production processes (e.g. soldering etc.) of the customer.
The bottom layer of LEON-G100 / LEON-G200 shows some unprotected copper areas for
GND
and
VCC
signals,
plus
GND
keep-out for internal RF signals routing.
Consider “No-routing” areas for the LEON-G100 / LEON-G200 footprint as follows:
1.
Ground copper and signals keep-out below LEON-G100 / LEON-G200 on Application Motherboard due to
VCC
area, RF
ANT
pin and exposed GND pad on module bottom layer (see Figure 49).
2.
Signals Keep-Out below module on Application Motherboard due to GND opening on LEON-G100 /
LEON-G200 bottom layer for internal RF signals (see Figure 50).
