LEON-G100 / LEON-G200 - System Integration Manual
GSM.G1-HW-09002-G3
Preliminary
Handling and soldering
Page 114 of 125
4.2.10
Casting
If casting is required, use viscose or another type of silicon pottant. The OEM is strongly advised to qualify such
processes in combination with the LEON-G100 / LEON-G200 module before implementing this in the
production.
Casting will void the warranty.
4.2.11
Grounding metal covers
Attempts to improve grounding by soldering ground cables, wick or other forms of metal strips directly onto the
EMI covers is done at the customer's own risk. The numerous ground pins should be sufficient to provide
optimum immunity to interferences and noise.
u-blox gives no warranty for damages to the LEON-G100 / LEON-G200 module caused by soldering
metal cables or any other forms of metal strips directly onto the EMI covers.
4.2.12
Use of ultrasonic processes
Some components on the LEON-G100 / LEON-G200 module are sensitive to Ultrasonic Waves. Use of any
Ultrasonic Processes (cleaning, welding etc.) may cause damage to the module.
u-blox gives no warranty against damages to the LEON-G100 / LEON-G200 module caused by any
Ultrasonic Processes.