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2.18 -- Thermal Interface Material
There are two types of thermal interface
materials designed for use with the AMD
Opteron processor.
The most common material comes as a small
pad attached to the heatsink at the time of
purchase. There should be a protective cover
over the material. Take care not to touch this
material.
Simply remove the protective cover and place
the heatsink on the processor.
The second type of interface material is usually
packaged separately. It is commonly referred to
as ‘thermal compound’. Simply apply a thin
layer on to the CPU lid (applying too much will
actually reduce the cooling).
NOTE
Aways check with the manufacturer of the heatsink & processor to
ensure the Thermal Interface material is compatible with the
processor & meets the manufacturer’s warranty requirements
2.19 Heatsink Installation Procedures
Type A: CAM LEVER (TYPE) INSTALLATION
1. After placing backplate and interface
material under motherboard place heatsink
retention frame on top of motherboard. Align
plastic retention bracket screw hole
with CPU back-plate standoffs.
Tighten screws to secure plastic retention
bracket. Repeat for on other side.
DO NOT OVER TIGHTEN.
2. After tightening screws secure metal clip to
plastic retention bracket center tab. Repeat for
on other side of heatsink.
