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3.8.1 DRAM Configuration
Phoenix-AwardBIOS CMOS Setup Utility
DRAM Configuration
Item Specific Help
Timing Mode
x Memclock index value (Mhz)
x CAS# latency (Tel)
S/W memory hole Romapping
H/W memory hole Remapping
MTRR mapping mode
DRAM ECC feature control
ECC memory Interlock
ECC MCE enable
Chip-Kill mode enable
ECC Redirection
DRAM background scrubber
L2 cache background scrub
DCache background scrubber
[Auto]
200Mhz
2.5
[Enabled]
[Disabled]
[Continuous]
[Enabled]
[At Least One]
[Enabled]
[Disabled]
[Enabled]
[Disabled]
[Disabled]
[Disabled]
Timing Mode
This option permits you to either manually select memory timings, or allow
the SPD (Serial Presence Detect) to determine the said timings automatically.
Auto
/ Manual
Memclock index value (Mhz)
This feature is used to set the Memclock index value.
100Mhz / 133Mhz / 166Mhz /
200Mhz
CAS# latency (Tel)
This setting controls the time delay (in clock cycles - CLKs) that passes
before the DRAM starts to carry out a read command after receiving it. This
also determines the number of CLKs for the completion of the first part of a
burst transfer. In other words, the lower the latency, the faster the
transaction.
2 /
2.5
/ 3
S/W Memory Hole Remapping
This feature is used to configure the function of S/W memory hole remapping.
Enabled
/ Disabled
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