TYAN S7055, Руководство пользователя

Страница: 43 / 120

http://www.tyan.com
43
Intel®Xeon®processor E5-2600/4600 product families UDIMM Support
1.35V 1.50V Ranks Per DIMM &
Data Width
Memory Capacity per DIMM
1DPC 1DPC
SRx8 Non-ECC
1 GB 2GB 4GB N/A 1066, 1333, 1600
DRx8 Non-ECC
2GB 4GB 8GB N/A 1066, 1333, 1600
SRx16 Non-ECC
512 MB 1GB 2GB N/A 1066, 1333, 1600
SRx8 ECC
1GB 2GB 4GB 1066 1066, 1333, 1600
DRx8 ECC
2GB 4GB 8GB 1066 1066, 1333, 1600
NOTE 1:
The blue blocks indicate that the DRAM Densities are supported but not validated.
NOTE 2:
The grey blocks indicate that the DRAM Densities are supported and validated.
NOTE 3:
1DPC => One dimm per channel

Supported DRAM Densities are 1Gb, 2Gb and 4Gb. Only 2Gb and 4Gb are validated
by Intel.

Command Address Timing is 1N for 1DPC and 2N for 2DPC.

Romley-EP/EX platform does not support 3DPC when using UDIMMs.
Intel®Xeon®processor E5-2600/4600 product families LRDIMM Support
1.35V 1.50V Ranks Per DIMM & Data
Width Memory Capacity
per DIMM
1DPC 1DPC
QRx4 (DDP)
16GB 32GB 1066 1066, 1333
QRx8 (P)
8GB 16GB 1066 1066, 1333
NOTE:
The grey blocks indicate that the DRAM Densities are supported and validated.

Physical Rank is used to calculate DIMM Capacity.

Supported and validated DRAM Densities are 2Gb and 4Gb.

Command Address Timing is 1N.

The speeds are estimated targets and will be verified through simulation.

For 3SPC/3DPC -Rank Multiplication (RM) >= 2.

DDP -Dual Die Package DRAM stacking. P –Planer monolithic DRAM Die.

Romley-EP/EX platform does not support 3DPC when using E5-2400 LRDIMMs.