Hangzhou Tuya Information Technology Co., Ltd. 13
V1.0.0
iii. Constant-temperature iron
iv. Wave solder bar, wire, and flux
v.
Oven temperature tester
(1) Baking equipment:
i.
Cabinet oven
ii.
Anti-static heat-resistant trays
iii. Anti-static heat-resistant gloves
3. Bake the module if any of the following conditions is met:
(1) The vacuum package is damaged before the module is unpacked.
(2) The package does not contain a humidity indicator card (HIC).
(3) After the module is unpacked, the HIC shows that the 30% and higher rate circles
are pink.
(4) Production is not completed within 72 hours after the module is unpacked.
(5) The module has been packed for more than six months.
4. Baking settings:
(1) Baking temperature: 65±5°C in reel pack mode and 125±5°C in tray pack mode
(2) Baking time: 48 hours in reel pack mode and 12 hours in tray pack mode
(3) Alarm temperature: 70°C in reel pack mode and 130°C in tray pack mode
(4) Production ready temperature after natural cooling: < 36°C
(5) Number of baking times: 1
(6) Rebaking condition: Production is not completed within 72 hours after baking.
5. Do not wave solder modules that have been unpacked for over three months.
Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are
exposed to the air for over three months, they will be oxidized severely and dry joints
or solder skips may occur. Tuya is not liable for such problems and consequences.
6. Throughout the production process, take electrostatic discharge (ESD) protective
measures.
7. For a good product quality, ensure that the following items meet requirements:
(1) Flux amount
(2) Wave height
(3) Amount of tin dross and copper in the solder pot
