3. Insure that the soldering tip is clean prior to any
soldering. A clean solder tip is one wiped lightly across
a damp sponge to remove oxides prior to use. It is essential for maximum heat
transfer that there are few contaminants on the tip.
4. When applying the soldering iron to a connection to be made, it is important to lay the
tip in such a position that the maximum surface area of the tip is presented to the
connection. In this way, the maximum heat is transferred to the connection in the
minimal amount of time.
5. Apply solder to the work and not the iron. In this way, a properly heated connection
will readily accept the solder, further reducing the chances for unreliability.
6. Use only clean, good quality, rosin core solder. Poor quality or dirty solder will not melt
smoothly and will deposit contaminants into the connection, making it weak.
7. Use only the amount of solder needed to complete the connection. Use too little solder
and the connections is compromised where as too much solder runs the risk of
accidentally contacting neighboring connections.
8. Finish the connection by removing the soldering iron quickly. It is important to apply
heat only for as long as it needed to properly flow the solder. Any additional heat runs
the risk of overheating the parts being soldered.
9. Do not move the parts of the connection while the solder is hardening. It is important
that everything stays totally still until the solder has fully set because any movement in
the parts while the solder is in a plastic state will result in a weak, unreliable, and
cracked connection.
10. Clean any rosin residues from freshly made connections. Rosin residues can trap dirt
and dust that could weaken a connection and possibly create arcing conditions.
Isopropyl or ethel alcohol and a stiff bristled brush are good for this.
Sequence of Events to Make a Good Connection
1. Establish a good mechanical connection of the components prior to soldering.
2. Place the tip of the iron firmly against the connection to be soldered.
3. Let connection reach soldering temperature (usually within 1 to 2 seconds).
4. Feed solder into the point where the soldering iron tip meets the connection, not on to
the tip of the soldering iron.
5. Feed an adequate amount of solder into the connection for the solder to flow around
the components to be joined.
6. When adequate amount has been reached, remove solder and iron simultaneously.
7. Do not move connection or components until solder has solidified.
8. Clip off any excess wire lead(s).
30 TubeDepot.com
