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User's Manual l MBa8x UM 0100 l © 2021, TQ-Systems GmbH
Page 41
Figure 28: Position of heat sink mounting holes
Attention: TQMa8x heat dissipation
The i.MX 8 CPU belongs to a performance category in which a cooling system is essential.
It is the user’s sole responsibility to define a suitable heat sink (weight and mounting position)
depending on the specific mode of operation (e.g., dependence on clock frequency, stack height,
airflow, and software).
Particularly the tolerance chain (PCB thickness, board warpage, BGA balls, BGA package, thermal pad,
heatsink) as well as the maximum pressure on the TQMa8x must be taken into consideration when
connecting the heat sink.
The TQMa8x is not the highest component. Inadequate cooling connections can lead to overheating
of the TQMa8x and thus malfunction, deterioration or destruction.
3.17
Fan
The CPU's power consumption requires a heat sink and fan for temperature management. The fan is controlled directly by the
CPU. A four-pin header X24 with a 2.54 mm pitch is used for this.
FTM_CH2 is provided for the connection of a tachometer signal, PWM3_OUT for speed control and FAN_PWR for switching off
the fan. Due to the good availability of compatible devices, 12 V is chosen as supply voltage for the fan, 5 V is optionally possible.
In case the FTM module is not supported by the software, the pin can be multiplexed as GPIO.