User's Manual l MBa7x UM 0101 l © 2020, TQ-Systems GmbH
Page 61
6.
MECHANICS
6.1
Dimensions
The MBa7x has overall dimensions (length × width) of 170 × 170 mm
2
.
The MBa7x has a maximum height of approximately 26.4 mm.
The MBa7x has six 4.3 mm holes for mounting in a housing and three 3.2 mm holes for mounting a heat sink.
The MBa7x weighs approximately 240 grams without TQMa7x.
Figure 52: MBa7x dimensions
Note:
Component placement on carrier board
2.5 mm should be kept free on the carrier board, on both long sides of the TQMa7x
for the extraction tool MOZIa7x.
6.2
Thermal management
No special precautions were taken concerning the thermal management of the MBa7x.
At 100 % CPU load MBa7x and TQMa7x consume approx. 6.5 W.
Attention:
Destruction or malfunction, TQMa7x heat dissipation
The i.MX7 belongs to a performance category in which a cooling system is essential.
It is the user’s sole responsibility to define a suitable heat sink (weight and mounting position)
depending on the specific mode of operation (e.g., dependence on clock frequency, stack height,
airflow, and software). Particularly the tolerance chain (PCB thickness, board warpage, BGA balls, BGA
package, thermal pad, heatsink) as well as the maximum pressure on the i.MX7 must be taken into
consideration when connecting the heat sink, see (1), and (2).
The i.MX7 is not necessarily the highest component. Inadequate cooling connections can lead to
overheating of the TQMa7x and thus malfunction, deterioration or destruction.
