Mobile Communications Division
Customer Services
Version 1.0 14/08/2006
Created by Konrad Szombara
Page 98 of 103
7.3 ACF – ANISOTROPIC CONDUCTIVE FILM
ACF is a reliable, cheap and efficient way of bonding. On the TS608 ACF
Technology has been used to bond the following components to the PCB
LCD Module
CMOS / Camera Module
Keypad Module
MP3 FPC Module
In order to replace such components, it must be understood the exact
requirements and exactly what is required.
Due to the high reliability accompanied by ACF technology it should be a
rare occurrence that means a replacement.
Consider the following diagrams to understand the actual bond.
As you can see, there are many particles spread across the PCB and FPC,
some are bonded and some are not. Because of the many particles, an open
circuit (dry joint) is unlikely as, if one particle goes open there are many more
to secure the connection. This same type of bonding has been used for
years on technologies such as Laptop’s. How many LCD’s have you seen go
blank on a phone and how many on a Laptop?
There are 2 ways of bonding. You can use ACF Tape and Shown below:
