20061215
1-20-2
E9BA4EL
C379
CE1JMAVSLR47
ELECTROLYTIC CAP. 0.47
μ
F/
50V M H7
C381
CHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z
0.1
μ
F/50V
C382
CHD1JK30B222
CHIP CERAMIC CAP. B K
2200pF/50V
C383
CHD1JK30B222
CHIP CERAMIC CAP. B K
2200pF/50V
C384
CE1JMAVSL2R2
ELECTROLYTIC CAP. 2.2
μ
F/
50V M H7
C402
CMA1JJP00183
FILM CAP.(P) 0.018
μ
F/50V J
C403
CCD2AKS0B471
CERAMIC CAP. B K 470pF/
100V
C404
CE0KMASSL221
ELECTROLYTIC CAP. 220
μ
F/
6.3V M H7
C405
CE0KMAVSL470
ELECTROLYTIC CAP. 47
μ
F/
6.3V M H7
C407
CHD1JK30B102
CHIP CERAMIC CAP.(1608) B
K 1000pF/50V
C408
CHD1JK30B182
CHIP CERAMIC CAP. B K
1800pF/50V
C409
CHD1JJ3CH330
CHIP CERAMIC CAP.(1608)
CH J 33pF/50V
C410
CE1CMAVSL100
ELECTROLYTIC CAP. 10
μ
F/
16V M H7
C411
CHD1JK30B103
CHIP CERAMIC CAP.(1608) B
K 0.01
μ
F/50V
C412
CE0KMAVSL330
ELECTROLYTIC CAP. 33
μ
F/
6.3V M H7
C413
CHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z
0.1
μ
F/50V
C414
CHD1JK30B223
CHIP CERAMIC CAP.(1608) B
K 0.022
μ
F/50V
C415
CE1EMAVSL4R7
ELECTROLYTIC CAP. 4.7
μ
F/
25V M H7
C416
CHD1JK30B472
CHIP CERAMIC CAP.(1608) B
K 4700pF/50V
C417
CE0KMAVSL220
ELECTROLYTIC CAP. 22
μ
F/
6.3V M H7
C418
CHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z
0.1
μ
F/50V
C419
CHD1JJ3CH221
CHIP CERAMIC CAP. CH J
220pF/50V
C421
CE0KMAVSL470
ELECTROLYTIC CAP. 47
μ
F/
6.3V M H7
C451
CHD1JJ3CH220
CHIP CERAMIC CAP.(1608)
CH J 22pF/50V
C452
CE1CMAVSL100
ELECTROLYTIC CAP. 10
μ
F/
16V M H7
C453
CE1AMAVSL220
ELECTROLYTIC CAP. 22
μ
F/
10V M H7
C454
CHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z
0.1
μ
F/50V
C455
CHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z
0.1
μ
F/50V
C456
CE1CMAVSL100
ELECTROLYTIC CAP. 10
μ
F/
16V M H7
C457
CE1EMAVSL4R7
ELECTROLYTIC CAP. 4.7
μ
F/
25V M H7
C458
CHD1JK30B103
CHIP CERAMIC CAP.(1608) B
K 0.01
μ
F/50V
C461
CHD1JK30B103
CHIP CERAMIC CAP.(1608) B
K 0.01
μ
F/50V
C462
CHD1JK30B472
CHIP CERAMIC CAP.(1608) B
K 4700pF/50V
C463
CE1AMAVSL220
ELECTROLYTIC CAP. 22
μ
F/
10V M H7
C464
CHD1JK30B103
CHIP CERAMIC CAP.(1608) B
K 0.01
μ
F/50V
C465
CE1CMAVSL100
ELECTROLYTIC CAP. 10
μ
F/
16V M H7
C466
CHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z
0.1
μ
F/50V
C467
CHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z
0.1
μ
F/50V
C468
CE0KMAVSL221
ELECTROLYTIC CAP. 220
μ
F/
6.3V M H7
C469
CE1AMAVSL220
ELECTROLYTIC CAP. 22
μ
F/
10V M H7
C470
CHD1JK30B472
CHIP CERAMIC CAP.(1608) B
K 4700pF/50V
!
Location
No.
TSB P/N
Reference No.
Description
C471
CHD1JK30B103
CHIP CERAMIC CAP.(1608) B
K 0.01
μ
F/50V
C472
CE1EMAVSL4R7
ELECTROLYTIC CAP. 4.7
μ
F/
25V M H7
C473
CE1CMAVSL100
ELECTROLYTIC CAP. 10
μ
F/
16V M H7
C474
CHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z
0.1
μ
F/50V
C475
CHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z
0.1
μ
F/50V
C476
CE0KMAVSL220
ELECTROLYTIC CAP. 22
μ
F/
6.3V M H7
C477
CHD1JJ3CH220
CHIP CERAMIC CAP.(1608)
CH J 22pF/50V
C478
CHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z
0.1
μ
F/50V
C479
CE1CMAVSL100
ELECTROLYTIC CAP. 10
μ
F/
16V M H7
C480
CE1CMAVSL100
ELECTROLYTIC CAP. 10
μ
F/
16V M H7
C481
CE1CMAVSL100
ELECTROLYTIC CAP. 10
μ
F/
16V M H7
C482
CHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z
0.1
μ
F/50V
C483
CE1EMAVSL4R7
ELECTROLYTIC CAP. 4.7
μ
F/
25V M H7
C484
CE1EMAVSL4R7
ELECTROLYTIC CAP. 4.7
μ
F/
25V M H7
C485
CE1CMAVSL100
ELECTROLYTIC CAP. 10
μ
F/
16V M H7
C486
CHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z
0.1
μ
F/50V
C487
CE1CMAVSL470
ELECTROLYTIC CAP. 47
μ
F/
16V M H7
C488
CHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z
0.1
μ
F/50V
C502
CHD1JK30B223
CHIP CERAMIC CAP.(1608) B
K 0.022
μ
F/50V
C505
CHD1JK30B103
CHIP CERAMIC CAP.(1608) B
K 0.01
μ
F/50V
C506
CE1JMASDL1R0
ELECTROLYTIC CAP. 1
μ
F/50V
M
C507
CHD1JK30B102
CHIP CERAMIC CAP.(1608) B
K 1000pF/50V
C508
CHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z
0.1
μ
F/50V
C509
CHD1JK30B102
CHIP CERAMIC CAP.(1608) B
K 1000pF/50V
C510
CHD1JK30B472
CHIP CERAMIC CAP.(1608) B
K 4700pF/50V
C511
CHD1JJ3CH101
CHIP CERAMIC CAP.(1608)
CH J 100pF/50V
C512
CHD1JK30B103
CHIP CERAMIC CAP.(1608) B
K 0.01
μ
F/50V
C514
CHD1JK30B331
CHIP CERAMIC CAP. B K
330pF/50V
C515
CHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z
0.1
μ
F/50V
C516
CE0KMAVSL220
ELECTROLYTIC CAP. 22
μ
F/
6.3V M H7
C517
CCA1EZTFZ223
CERAMIC CAP.(AX) F Z
0.022
μ
F/25V
C518
CE0KMAVSL220
ELECTROLYTIC CAP. 22
μ
F/
6.3V M H7
C519
CHD1JJ3CH561
CHIP CERAMIC CAP. CH J
560pF/50V
C521
CE0KMAVSL220
ELECTROLYTIC CAP. 22
μ
F/
6.3V M H7
C522
CHD1JK30B103
CHIP CERAMIC CAP.(1608) B
K 0.01
μ
F/50V
C524
CHD1JK30B103
CHIP CERAMIC CAP.(1608) B
K 0.01
μ
F/50V
C527
CCA1JKT0B101
CERAMIC CAP.(AX) B K 100pF/
50V
C531
CHD1JK30B472
CHIP CERAMIC CAP.(1608) B
K 4700pF/50V
C533
CHD1JK30B473
CHIP CERAMIC CAP.(1608) B
K 0.047
μ
F/50V
C534
CE0KMAVSL470
ELECTROLYTIC CAP. 47
μ
F/
6.3V M H7
!
Location
No.
TSB P/N
Reference No.
Description
Содержание D-VR41KF
Страница 55: ...1 13 3 E9BA4SCM1 Main 1 10 Schematic Diagram VCR Section NOTE BOARD MEANS PRINTED CIRCUIT BOARD ...
Страница 57: ...1 13 5 E9BA4SCM3 Main 3 10 Schematic Diagram VCR Section NOTE BOARD MEANS PRINTED CIRCUIT BOARD ...
Страница 58: ...1 13 6 E9BA4SCM4 Main 4 10 Schematic Diagram VCR Section NOTE BOARD MEANS PRINTED CIRCUIT BOARD ...
Страница 59: ...1 13 7 E9BA4SCM5 Main 5 10 Schematic Diagram VCR Section NOTE BOARD MEANS PRINTED CIRCUIT BOARD ...
Страница 60: ...1 13 8 E9BA4SCM6 Main 6 10 Front Jack Schematic Diagram VCR Section NOTE BOARD MEANS PRINTED CIRCUIT BOARD ...
Страница 61: ...1 13 9 E9BA4SCM7 Main 7 10 Schematic Diagram VCR Section NOTE BOARD MEANS PRINTED CIRCUIT BOARD ...
Страница 62: ...1 13 10 E9BA4SCM8 Main 8 10 Schematic Diagram VCR Section NOTE BOARD MEANS PRINTED CIRCUIT BOARD ...
Страница 63: ...1 13 11 E9BA4SCM9 Main 9 10 Schematic Diagram VCR Section NOTE BOARD MEANS PRINTED CIRCUIT BOARD ...
Страница 64: ...1 13 12 E9BA2SCM10 Main 10 10 Schematic Diagram VCR Section NOTE BOARD MEANS PRINTED CIRCUIT BOARD ...
Страница 66: ...1 13 14 E9BA4SCRJ Rear Jack Schematic Diagram VCR Section NOTE BOARD MEANS PRINTED CIRCUIT BOARD ...
Страница 67: ...1 13 15 E9BA4SCAFV AFV Schematic Diagram VCR Section NOTE BOARD MEANS PRINTED CIRCUIT BOARD ...
Страница 87: ...1 18 2 E9BA4PEX Packing X1 X9 X3 X22B X20B X22 X20A ...
Страница 124: ......