Toshiba D-VR41KF, Руководство по обслуживанию

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20061215 1-20-1 E9BA4EL
ELECTRICAL PARTS LIST
PRODUCT SAFETY NOTE: Products marked with a
!
have special characteristics important to safety.
Before replacing any of these components, read
carefully the product safety notice in this service
manual. Don't degrade the safety of the product
through improper servicing.
NOTES:
1. Parts that are not assigned part numbers (---------)
are not available.
2. Tolerance of Capacitors and Resistors are noted
with the following symbols.
DVD MECHANISM & DVD MAIN
BOARD ASSEMBLY
BOARD MCV
BOARD MAIN
C.....±0.25% D.....±0.5% F.....±1%
G.....±2% J......±5% K.....±10%
M.....±20% N.....±30% Z.....+80/-20%
!
Location
No.
TSB P/N Reference No. Description
!
P2 P000465140 N78ECCFN DVD MECHANISM & DVD
BOARD MAIN ASSEMBLY
!
Location
No.
TSB P/N Reference No. Description
!
P1 P000465130 1VSA14661 BOARD MCV
Consists of the following
---------- BOARD MAIN (MCV-A )
---------- BOARD POWER SWITCH
(MCV-B)
---------- BOARD FUNCTION (MCV-C)
---------- BOARD FRONT JACK (MCV-D)
P4 P000465450 1VSA11699 BOARD SENSOR
!
Location
No.
TSB P/N Reference No. Description
---------- BOARD MAIN (MCV-A )
Consists of the following:
CAPACITORS
C251 CE1CMAVSL100 ELECTROLYTIC CAP. 10
μ
F/
16V M H7
C252 CHD1JZ30F104 CHIP CERAMIC CAP.(1608) F Z
0.1
μ
F/50V
C253 CHD1JK30B102 CHIP CERAMIC CAP.(1608) B
K 1000pF/50V
C254 CE1JMAVSL1R0 ELECTROLYTIC CAP. 1
μ
F/50V
M H7
C301 CHD1JK30B223 CHIP CERAMIC CAP.(1608) B
K 0.022
μ
F/50V
C302 CE1JMAVSL1R0 ELECTROLYTIC CAP. 1
μ
F/50V
M H7
C303 CHD1JZ30F104 CHIP CERAMIC CAP.(1608) F Z
0.1
μ
F/50V
C305 CE1JMAVSL1R0 ELECTROLYTIC CAP. 1
μ
F/50V
M H7
C306 CHD1JK30B473 CHIP CERAMIC CAP.(1608) B
K 0.047
μ
F/50V
C307 CHD1JK30B223 CHIP CERAMIC CAP.(1608) B
K 0.022
μ
F/50V
C308 CHD1JZ30F104 CHIP CERAMIC CAP.(1608) F Z
0.1
μ
F/50V
C311 CHD1JZ30F104 CHIP CERAMIC CAP.(1608) F Z
0.1
μ
F/50V
C312 CE1CMAVSL100 ELECTROLYTIC CAP. 10
μ
F/
16V M H7
C313 CE1JMASSL1R0 ELECTROLYTIC CAP. 1
μ
F/50V
M H7
C314 CHD1JK30B103 CHIP CERAMIC CAP.(1608) B
K 0.01
μ
F/50V
C315 CHD1JK30B473 CHIP CERAMIC CAP.(1608) B
K 0.047
μ
F/50V
C316 CE1JMAVSL1R0 ELECTROLYTIC CAP. 1
μ
F/50V
M H7
C317 CHD1JZ30F104 CHIP CERAMIC CAP.(1608) F Z
0.1
μ
F/50V
C322 CHD1JZ30F104 CHIP CERAMIC CAP.(1608) F Z
0.1
μ
F/50V
C324 CHD1JK30B103 CHIP CERAMIC CAP.(1608) B
K 0.01
μ
F/50V
C325 CHD1JK30B822 CHIP CERAMIC CAP. B K
8200pF/50V
C326 CHD1JZ30F104 CHIP CERAMIC CAP.(1608) F Z
0.1
μ
F/50V
C328 CE0KMAVSL470 ELECTROLYTIC CAP. 47
μ
F/
6.3V M H7
C329 CHD1JZ30F104 CHIP CERAMIC CAP.(1608) F Z
0.1
μ
F/50V
C330 CE1CMASDL101 ELECTROLYTIC CAP. 100
μ
F/
16V M
C331 CE0KMASDL221 ELECTROLYTIC CAP. 220
μ
F/
6.3V M
C333 CHD1JZ30F104 CHIP CERAMIC CAP.(1608) F Z
0.1
μ
F/50V
C334 CE1JMAVSL1R0 ELECTROLYTIC CAP. 1
μ
F/50V
M H7
C335 CE0KMAVSL101 ELECTROLYTIC CAP. 100
μ
F/
6.3V H7
C336 CHD1JJ3CH221 CHIP CERAMIC CAP. CH J
220pF/50V
C337 CHD1JZ30F104 CHIP CERAMIC CAP.(1608) F Z
0.1
μ
F/50V
C339 CHD1JJ3CH121 CHIP CERAMIC CAP. CH J
120pF/50V
C340 CE1JMAVSL1R0 ELECTROLYTIC CAP. 1
μ
F/50V
M H7
C341 CHD1JD3CH100 CHIP CERAMIC CAP.(1608)
CH D 10pF/50V
C342 CHD1JJ3CH102 CHIP CERAMIC CAP.(1608)
CH J 1000pF/50V
C343 CE1CMAVSL100 ELECTROLYTIC CAP. 10
μ
F/
16V M H7
C344 CP1EMAVSB4R7 ELECTROLYTIC CAP. 4.7
μ
F/
25V M NP H7
C345 CE1JMAVSLR47 ELECTROLYTIC CAP. 0.47
μ
F/
50V M H7
C347 CHD1EK30B104 CHIP CERAMIC CAP.(1608) B
K 0.1
μ
F/25V
C349 CE1JMAVSLR47 ELECTROLYTIC CAP. 0.47
μ
F/
50V M H7
C350 CCA1JZTFZ104 CERAMIC CAP.(AX) F Z 0.1
μ
F/
50V
C370 CCA1CMT0Y103 CERAMIC CAP.(AX) Y M
0.01
μ
F/16V
C371 CHD1JK30B223 CHIP CERAMIC CAP.(1608) B
K 0.022
μ
F/50V
C372 CHD1JZ30F104 CHIP CERAMIC CAP.(1608) F Z
0.1
μ
F/50V
C373 CHD1JZ30F104 CHIP CERAMIC CAP.(1608) F Z
0.1
μ
F/50V
C374 CHD1JZ30F104 CHIP CERAMIC CAP.(1608) F Z
0.1
μ
F/50V
C375 CHD1JK30B103 CHIP CERAMIC CAP.(1608) B
K 0.01
μ
F/50V
C376 CHD1JK30B223 CHIP CERAMIC CAP.(1608) B
K 0.022
μ
F/50V
C377 CHD1JK30B103 CHIP CERAMIC CAP.(1608) B
K 0.01
μ
F/50V
C378 CHD1JK30B103 CHIP CERAMIC CAP.(1608) B
K 0.01
μ
F/50V
!
Location
No.
TSB P/N Reference No. Description