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3.17 MISC Connector
The board provides signals for thermal overheat of external hardware and the processor, utility signals for SD and GPIO0.
.
3V3
GPIO0
SDIOWP
THRM TRIP#
GND
THRM#
Fig. 3.16: MISC header
3.18 RF-Module
An additional RF-Module for wireless communication can be soldered on the bottom right of the baseboard.
For more info’s visit: https://www.theobroma-systems.com/rf-modules-3815
Release v0.2-3-g574c114
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Содержание RK3399-Q7
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