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Layout Guidelines
Figure 11. Module Layout Guidelines (Top Layer)
Figure 12. Module Layout Guidelines (Bottom Layer)
Table 3
describes the guidelines corresponding to the reference numbers in
Figure 11
and
Figure 12
.
Table 3. Module Layout Guidelines
Reference
Guideline Description
1
Keep the proximity of ground vias close to the pad.
2
Do not run signal traces underneath the module on the layer where the module is mounted.
3
Have a complete ground pour in layer 2 for thermal dissipation.
4
Ensure a solid ground plane and ground vias under the module for stable system and thermal dissipation.
5
Increase ground pour in the first layer and have all traces from the first layer on the inner layers, if possible.
6
Signal traces can be run on a third layer under the solid ground layer and the module mounting layer.
13
SWRU382 – November 2014
WL1837MODCOM8I WLAN MIMO and Bluetooth
®
Module Evaluation Board for
TI Sitara™ Platform
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