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Circuit Design

www.ti.com

5.2

Bill of Materials (BOM)

Table 2

lists the BOM for the EVB.

Table 2. BOM

Item

Description

Part Number

Package

Reference

Qty

Mfr

1

TI WL1837 Wi-Fi /

Bluetooth

WL1837MODGI

13.4 mm x 13.3 mm

U1

1

Jorjin

module

x 2.0 mm

2

XOSC 3225 / 32.768KHZ / 1.8 V /

7XZ3200005

3.2 mm × 2.5 mm ×

OSC1

1

TXC

±50 ppm

1.0 mm

3

Antenna / Chip / 2.4 and 5 GHz

W3006

10.0 mm × 3.2 mm

ANT1, ANT2

2

Pulse

× 1.5 mm

4

Mini RF header receptacle

U.FL-R-SMT-1(10)

3.0 mm × 2.6 mm ×

J5, J6

2

Hirose

1.25 mm

5

Inductor 0402 / 1.3 nH / ±0.1 nH /

LQP15MN1N3B02

0402

L1

1

Murata

SMD

6

Inductor 0402 / 1.8 nH / ±0.1 nH /

LQP15MN1N8B02

0402

L3

1

Murata

SMD

7

Inductor 0402 / 2.2 nH / ±0.1 nH /

LQP15MN2N2B02

0402

L4

1

Murata

SMD

8

Capacitor 0402 / 1 pF / 50 V / C0G GJM1555C1H1R0BB01

0402

C13

1

Murata

/ ±0.1 pF

9

Capacitor 0402 / 2.4 pF / 50 V /

GJM1555C1H2R4BB01

0402

C14

1

Murata

C0G / ±0.1 pF

10

Capacitor 0402 / 0.1 µF / 10 V /

0402B104K100CT

0402

C3, C4

2

Walsin

X7R / ±10%

11

Capacitor 0402 / 1 µF / 6.3 V /

GRM155R60J105KE19D

0402

C1

1

Murata

X5R / ±10% / HF

12

Capacitor 0603 / 10 µF / 6.3 V /

C1608X5R0J106M

0603

C2

1

TDK

X5R / ±20%

13

Resistor 0402 / 0R / ±5%

WR04X000 PTL

0402

R1 to R4, R6 to

31

Walsin

R19, R21 to

R30, R33, C5,

C6

(1)

14

Resistor 0402 / 10K / ±5%

WR04X103 JTL

0402

R20

1

Walsin

15

Resistor 0603 / 0R / ±5%

WR06X000 PTL

0603

R31, R32

2

Walsin

16

PCB WG7837TEC8B D02 / Layer

76.0 mm × 31.0 mm

1

茂榮

4 / FR4 (4 pcs / PNL)

× 1.6 mm

(1)

C5 and C6 are mounted with a 0-

Ω

resistor by default.

10

WL1837MODCOM8I WLAN MIMO and Bluetooth

®

Module Evaluation Board

SWRU382 – November 2014

for TI Sitara™ Platform

Submit Documentation Feedback

Copyright © 2014, Texas Instruments Incorporated

Содержание WL1837MODCOM8I

Страница 1: ...ections 7 3 Electrical Characteristics 7 4 Antenna Characteristics 8 4 1 VSWR 8 4 2 Efficiency 8 4 3 Radio Pattern 9 5 Circuit Design 9 5 1 EVB Reference Schematics 9 5 2 Bill of Materials BOM 10 6 Layout Guidelines 11 6 1 Board Layout 11 7 Ordering Information 16 List of Figures 1 WL1837MODCOM8I EVB Top View 3 2 EVB Top View 4 3 EVB Bottom View 5 4 Antenna VSWR Characteristics 8 5 Antenna Efficie...

Страница 2: ...ttom Layer Antenna and RF Trace Routing Layout Guidelines 15 17 MIMO Antenna Spacing 16 List of Tables 1 Pin Description 5 2 BOM 10 3 Module Layout Guidelines 13 4 Antenna and RF Trace Routing Layout Guidelines 15 2 WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board SWRU382 November 2014 for TI Sitara Platform Submit Documentation Feedback Copyright 2014 Texas Instruments Incorporated ...

Страница 3: ...ice Shared host controller interface HCI transport for Bluetooth BLE and ANT using UART and SDIO for WLAN Wi Fi and Bluetooth single antenna coexistence Built in chip antenna Optional U FL RF connector for external antenna Direct connection to the battery using an external switched mode power supply SMPS supporting 2 9 to 4 8 V operation VIO in the 1 8 V domain 1 2 Key Benefits The WL1837MOD offer...

Страница 4: ...ce is designed for the following applications Portable consumer devices Home electronics Home appliances and white goods Industrial and home automation Smart gateway and metering Video conferencing Video camera and security 2 Board Pin Assignment Figure 2 shows the top view of the EVB Figure 2 EVB Top View 4 WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board SWRU382 November 2014 for T...

Страница 5: ...7 VBAT P 3 6 V typical voltage input 8 VIO P VIO 1 8 V I O voltage input 9 GND G Ground 10 N C No connection 11 WL_RS232_TX O WLAN tool RS232 output 12 N C No connection 13 WL_RS232_RX I WLAN tool RS232 input 14 N C No connection 15 WL_UART_DBG O WLAN Logger output 16 N C No connection 17 N C No connection 18 GND G Ground 19 GND G Ground 20 SDIO_CLK I WLAN SDIO clock 5 SWRU382 November 2014 WL1837...

Страница 6: ... C No connection 44 N C No connection 45 N C No connection 46 N C No connection 47 GND G Ground 48 N C No connection 49 N C No connection 50 N C No connection 51 N C No connection 52 PCM_IF_CLK I O Bluetooth PCM clock input or output 53 N C No connection 54 PCM_IF_FSYNC I O Bluetooth PCM frame sync input or output 55 N C No connection 56 PCM_IF_DIN I Bluetooth PCM data input 57 N C No connection 5...

Страница 7: ... No connection 91 N C No connection 92 GND G Ground 93 RESERVED2 I Reserved 94 N C No connection 95 GND G Ground 96 GPIO11 I O General purpose I O 97 GND G Ground 98 GPIO12 I O General purpose I O 99 TCXO_CLK_COM Option to supply 26 MHz externally 100 GPIO10 I O General purpose I O 2 2 Jumper Connections The WL1837MODCOM8I EVB includes the following jumper connections J1 Jumper connector for VIO p...

Страница 8: ...ristics Figure 4 Antenna VSWR Characteristics 4 2 Efficiency Figure 5 shows the antenna efficiency Figure 5 Antenna Efficiency 8 WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board SWRU382 November 2014 for TI Sitara Platform Submit Documentation Feedback Copyright 2014 Texas Instruments Incorporated ...

Страница 9: ...02 C32 NU_0 1uF 0402 R3 0R 0402 R16 0R 0402 U1 WL1837MODGJ E 13 4X13 3 N100_0 75 TOP GND 17 VIO 38 VBAT 47 EXT_32K 36 BT_AUD_FSYNC 58 BT_AUD_IN 56 BT_AUD_OUT 57 BT_AUD_CLK 60 WL_SDIO_D2 12 WL_SDIO_CLK 8 WL_SDIO_D3 13 WL_SDIO_D0 10 WL_SDIO_D1 11 WL_SDIO_CMD 6 BT_HCI_RTS 50 BT_HCI_RX 53 BT_HCI_TX 52 BT_HCI_CTS 51 GND 16 GPIO_4 25 GPIO_2 26 GPIO_1 27 BT_EN_SOC 41 WLAN_IRQ 14 WLAN_EN_SOC 40 BT_UART_DB...

Страница 10: ...acitor 0402 1 pF 50 V C0G GJM1555C1H1R0BB01 0402 C13 1 Murata 0 1 pF 9 Capacitor 0402 2 4 pF 50 V GJM1555C1H2R4BB01 0402 C14 1 Murata C0G 0 1 pF 10 Capacitor 0402 0 1 µF 10 V 0402B104K100CT 0402 C3 C4 2 Walsin X7R 10 11 Capacitor 0402 1 µF 6 3 V GRM155R60J105KE19D 0402 C1 1 Murata X5R 10 HF 12 Capacitor 0603 10 µF 6 3 V C1608X5R0J106M 0603 C2 1 TDK X5R 20 13 Resistor 0402 0R 5 WR04X000 PTL 0402 R1...

Страница 11: ... four layers of the WL1837MODCOM8I EVB Figure 7 WL1837MODCOM8I Layer 1 Layout Figure 8 WL1837MODCOM8I Layer 2 Layout 11 SWRU382 November 2014 WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board for TI Sitara Platform Submit Documentation Feedback Copyright 2014 Texas Instruments Incorporated ...

Страница 12: ...WL1837MODCOM8I Layer 4 Layout Figure 11 and Figure 12 show instances of good layout practices 12 WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board SWRU382 November 2014 for TI Sitara Platform Submit Documentation Feedback Copyright 2014 Texas Instruments Incorporated ...

Страница 13: ...where the module is mounted 3 Have a complete ground pour in layer 2 for thermal dissipation 4 Ensure a solid ground plane and ground vias under the module for stable system and thermal dissipation 5 Increase ground pour in the first layer and have all traces from the first layer on the inner layers if possible 6 Signal traces can be run on a third layer under the solid ground layer and the module...

Страница 14: ...ined With Layer 2 Figure 15 and Figure 16 show instances of good layout practices for the antenna and RF trace routing NOTE RF traces must be as short as possible The antenna RF traces and modules must be on the edge of the PCB product The proximity of the antenna to the enclosure and the enclosure material must also be considered 14 WL1837MODCOM8I WLAN MIMO and Bluetooth Module Evaluation Board S...

Страница 15: ...e RF trace bends must be gradual with an approximate maximum bend of 45 degrees with trace mitered RF 2 traces must not have sharp corners 3 RF traces must have via stitching on the ground plane beside the RF trace on both sides 4 RF traces must have constant impedance microstrip transmission line For best results the RF trace ground layer must be the ground layer immediately below the RF trace Th...

Страница 16: ...D3 in parallel to each other and as short as possible less than 12 cm In addition each trace must be the same length Ensure enough space between traces greater than 1 5 times the trace width or ground to ensure signal quality especially for the SDIO_CLK trace Remember to keep these traces away from the other digital or analog signal traces TI recommends adding ground shielding around these buses D...

Страница 17: ...esponsible for compliance with all legal regulatory and safety related requirements concerning its products and any use of TI components in its applications notwithstanding any applications related information or support that may be provided by TI Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failur...

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